A large-scale reconfigurable smart sensory chip

Sheng-Yu Peng; Gokce Gurun; Christopher M. Twigg; Muhammad S. Qureshi; Arindam Basu; Stephen Brink; Paul E. Hasler; F. L. Degertekin

doi:10.1109/ISCAS.2009.5118120

A large-scale reconfigurable smart sensory chip

Sheng-Yu Peng
, Gokce Gurun
, Christopher M. Twigg
, Muhammad S. Qureshi
, Arindam Basu
, Stephen Brink
, Paul E. Hasler
, F. L. Degertekin

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

19 Citations (Scopus)

Abstract

The Reconfigurable Smart Sensory Chip (RSSC) is a powerful tool for fast prototyping sensory microsystems. Innovative design ideas can be quickly realized and tested in hardware without doing time-consuming and expensive silicon fabrication. The RSSC is a large-scale floating-gate based IC containing 8 universal sensor interface blocks, each of which can be configured for voltage sensing, capacitive sensing, or current sensing, and 28 configurable analog blocks. The outputs of the interface circuits can be multiplexed out in a time-division sequence or can be routed to the configurable analog blocks for further analog signal processing or data conversion. With more than 50,000 programmable elements and on-chip programming circuitry, RSSC is an extremely powerful tool to develop and test a great variety of smart sensory microsystems in minutes. ©2009 IEEE.

Original language	English
Title of host publication	2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
Pages	2145-2148
DOIs	https://doi.org/10.1109/ISCAS.2009.5118120
Publication status	Published - 2009
Externally published	Yes
Event	2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009 - Taipei, Taiwan, China Duration: 24 May 2009 → 27 May 2009

Publication series

Name	Proceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)	0271-4310

Conference

Conference	2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
Place	Taiwan, China
City	Taipei
Period	24/05/09 → 27/05/09

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1109/ISCAS.2009.5118120

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Peng, S.-Y., Gurun, G., Twigg, C. M., Qureshi, M. S., Basu, A., Brink, S., Hasler, P. E., & Degertekin, F. L. (2009). A large-scale reconfigurable smart sensory chip. In 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009 (pp. 2145-2148). Article 5118220 (Proceedings - IEEE International Symposium on Circuits and Systems). https://doi.org/10.1109/ISCAS.2009.5118120

@inproceedings{1163f7b7a2ed472398b2e1024933233d,

title = "A large-scale reconfigurable smart sensory chip",

abstract = "The Reconfigurable Smart Sensory Chip (RSSC) is a powerful tool for fast prototyping sensory microsystems. Innovative design ideas can be quickly realized and tested in hardware without doing time-consuming and expensive silicon fabrication. The RSSC is a large-scale floating-gate based IC containing 8 universal sensor interface blocks, each of which can be configured for voltage sensing, capacitive sensing, or current sensing, and 28 configurable analog blocks. The outputs of the interface circuits can be multiplexed out in a time-division sequence or can be routed to the configurable analog blocks for further analog signal processing or data conversion. With more than 50,000 programmable elements and on-chip programming circuitry, RSSC is an extremely powerful tool to develop and test a great variety of smart sensory microsystems in minutes. {\textcopyright}2009 IEEE.",

author = "Sheng-Yu Peng and Gokce Gurun and Twigg, \{Christopher M.\} and Qureshi, \{Muhammad S.\} and Arindam Basu and Stephen Brink and Hasler, \{Paul E.\} and Degertekin, \{F. L.\}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].; 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009 ; Conference date: 24-05-2009 Through 27-05-2009",

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doi = "10.1109/ISCAS.2009.5118120",

language = "English",

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}

Peng, S-Y, Gurun, G, Twigg, CM, Qureshi, MS, Basu, A, Brink, S, Hasler, PE & Degertekin, FL 2009, A large-scale reconfigurable smart sensory chip. in 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009., 5118220, Proceedings - IEEE International Symposium on Circuits and Systems, pp. 2145-2148, 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009, Taipei, Taiwan, China, 24/05/09. https://doi.org/10.1109/ISCAS.2009.5118120

A large-scale reconfigurable smart sensory chip. / Peng, Sheng-Yu; Gurun, Gokce; Twigg, Christopher M. et al.
2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009. 2009. p. 2145-2148 5118220 (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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AU - Hasler, Paul E.

AU - Degertekin, F. L.

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A large-scale reconfigurable smart sensory chip

Abstract

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Bibliographical note

UN SDGs

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