A high-entropy alloy as very low melting point solder for advanced electronic packaging

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Y. Liu
  • L. Pu
  • C. Tan
  • X. Zhao
  • Q. Zhang
  • K.N. Tu

Detail(s)

Original languageEnglish
Article number100101
Journal / PublicationMaterials Today Advances
Volume7
Online published14 Aug 2020
Publication statusPublished - Sep 2020

Link(s)

Abstract

SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

Research Area(s)

  • Advanced electronic packaging technology, Diffusion kinetics, High-entropy alloy, Liquid-solid reactions, Pb-free solder

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