A General Weibull Model For Reliability Analysis Under Different Failure Criteria - Application on Anisotropic conductive adhesive joining technology

Johan Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh, Yong Tang

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'A General Weibull Model For Reliability Analysis Under Different Failure Criteria - Application on Anisotropic conductive adhesive joining technology'. Together they form a unique fingerprint.

Engineering