A Fully Transparent Resistive Memory for Harsh Environments

Po-Kang Yang, Chih-Hsiang Ho, Der-Hsien Lien, José Ramón Durán Retamal, Chen-Fang Kang, Kuan-Ming Chen, Teng-Han Huang, Yueh-Chung Yu, Chih-I Wu, Jr-Hau He*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

22 Citations (Scopus)
24 Downloads (CityUHK Scholars)

Abstract

A fully transparent resistive memory (TRRAM) based on Hafnium oxide (HfO2) with excellent transparency, resistive switching capability, and environmental stability is demonstrated. The retention time measured at 85 °C is over 3 × 104sec, and no significant degradation is observed in 130 cycling test. Compared with ZnO TRRAM, HfO2 TRRAM shows reliable performance under harsh conditions, such as high oxygen partial pressure, high moisture (relative humidity = 90% at 85 °C), corrosive agent exposure, and proton irradiation. Moreover, HfO2 TRRAM fabricated in cross-bar array structures manifests the feasibility of future high density memory applications. These findings not only pave the way for future TRRAM design, but also demonstrate the promising applicability of HfO2 TRRAM for harsh environments.
Original languageEnglish
Article number15087
JournalScientific Reports
Volume5
Online published12 Oct 2015
DOIs
Publication statusPublished - 2015
Externally publishedYes

Publisher's Copyright Statement

  • This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

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