A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN

Fukang Jiang; Yu-Chong Tai; Ken Walsh; Tom Tsao; Gwo-Bin Lee; Chih-Ming Ho

doi:10.1109/memsys.1997.581894

A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN

Fukang Jiang
, Yu-Chong Tai
, Ken Walsh
, Tom Tsao
, Gwo-Bin Lee
, Chih-Ming Ho

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

96 Citations (Scopus)

Abstract

A new microfabrication technology that enables the integration of MEMS devices on a flexible polyimide skin has been developed. Mechanically, the flexible skin consists of many individual Si islands (necessary for silicon MEMS/electronics devices) that are connected together by a thin/thick polyimide film (typically 1-100 μm thick). To create the islands, Si diaphragms are first formed with a desirable thickness (10-500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE). As a first application, flexible shear-stress sensor skins for aerodynamics study have been fabricated. The finished skin is 3 cm long and 1 cm wide, and it consists of about 100 sensors. The skin polyimide is 17 μm thick and the silicon islands are 75 μm thick. These skins have been successfully taped on a semi-cylindrical (1.3 cm diameter) delta wing leading edge to perform real-time 2-D shear stress profiling.

Original language	English
Title of host publication	Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems
Subtitle of host publication	An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots
Publisher	IEEE
Pages	465-470
ISBN (Print)	0780337441, 078033745X
DOIs	https://doi.org/10.1109/memsys.1997.581894
Publication status	Published - Jan 1997
Externally published	Yes
Event	Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS - Nagoya, Japan Duration: 26 Jan 1997 → 30 Jan 1997

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Publisher	IEEE
ISSN (Print)	1084-6999

Conference

Conference	Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS
Place	Japan
City	Nagoya
Period	26/01/97 → 30/01/97

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This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1109/memsys.1997.581894

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Jiang, F., Tai, Y.-C., Walsh, K., Tsao, T., Lee, G.-B., & Ho, C.-M. (1997). A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN. In Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems: An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots (pp. 465-470). (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). IEEE. https://doi.org/10.1109/memsys.1997.581894

Jiang, Fukang ; Tai, Yu-Chong ; Walsh, Ken et al. / A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN. Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems: An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE, 1997. pp. 465-470 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{39c17dd402764e0e9bef48b3c07b417a,

title = "A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN",

abstract = "A new microfabrication technology that enables the integration of MEMS devices on a flexible polyimide skin has been developed. Mechanically, the flexible skin consists of many individual Si islands (necessary for silicon MEMS/electronics devices) that are connected together by a thin/thick polyimide film (typically 1-100 μm thick). To create the islands, Si diaphragms are first formed with a desirable thickness (10-500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE). As a first application, flexible shear-stress sensor skins for aerodynamics study have been fabricated. The finished skin is 3 cm long and 1 cm wide, and it consists of about 100 sensors. The skin polyimide is 17 μm thick and the silicon islands are 75 μm thick. These skins have been successfully taped on a semi-cylindrical (1.3 cm diameter) delta wing leading edge to perform real-time 2-D shear stress profiling.",

author = "Fukang Jiang and Yu-Chong Tai and Ken Walsh and Tom Tsao and Gwo-Bin Lee and Chih-Ming Ho",

year = "1997",

month = jan,

doi = "10.1109/memsys.1997.581894",

language = "English",

isbn = "0780337441",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "IEEE",

pages = "465--470",

booktitle = "Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems",

address = "United States",

note = "Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS ; Conference date: 26-01-1997 Through 30-01-1997",

}

Jiang, F, Tai, Y-C, Walsh, K, Tsao, T, Lee, G-B & Ho, C-M 1997, A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN. in Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems: An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), IEEE, pp. 465-470, Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS, Nagoya, Japan, 26/01/97. https://doi.org/10.1109/memsys.1997.581894

A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN. / Jiang, Fukang; Tai, Yu-Chong; Walsh, Ken et al.
Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems: An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE, 1997. p. 465-470 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN

AU - Jiang, Fukang

AU - Tai, Yu-Chong

AU - Walsh, Ken

AU - Tsao, Tom

AU - Lee, Gwo-Bin

AU - Ho, Chih-Ming

PY - 1997/1

Y1 - 1997/1

N2 - A new microfabrication technology that enables the integration of MEMS devices on a flexible polyimide skin has been developed. Mechanically, the flexible skin consists of many individual Si islands (necessary for silicon MEMS/electronics devices) that are connected together by a thin/thick polyimide film (typically 1-100 μm thick). To create the islands, Si diaphragms are first formed with a desirable thickness (10-500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE). As a first application, flexible shear-stress sensor skins for aerodynamics study have been fabricated. The finished skin is 3 cm long and 1 cm wide, and it consists of about 100 sensors. The skin polyimide is 17 μm thick and the silicon islands are 75 μm thick. These skins have been successfully taped on a semi-cylindrical (1.3 cm diameter) delta wing leading edge to perform real-time 2-D shear stress profiling.

AB - A new microfabrication technology that enables the integration of MEMS devices on a flexible polyimide skin has been developed. Mechanically, the flexible skin consists of many individual Si islands (necessary for silicon MEMS/electronics devices) that are connected together by a thin/thick polyimide film (typically 1-100 μm thick). To create the islands, Si diaphragms are first formed with a desirable thickness (10-500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE). As a first application, flexible shear-stress sensor skins for aerodynamics study have been fabricated. The finished skin is 3 cm long and 1 cm wide, and it consists of about 100 sensors. The skin polyimide is 17 μm thick and the silicon islands are 75 μm thick. These skins have been successfully taped on a semi-cylindrical (1.3 cm diameter) delta wing leading edge to perform real-time 2-D shear stress profiling.

UR - https://www.scopus.com/pages/publications/0030645994

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0030645994&origin=recordpage

U2 - 10.1109/memsys.1997.581894

DO - 10.1109/memsys.1997.581894

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 0780337441

SN - 078033745X

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 465

EP - 470

BT - Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems

PB - IEEE

T2 - Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS

Y2 - 26 January 1997 through 30 January 1997

ER -

Jiang F, Tai YC, Walsh K, Tsao T, Lee GB, Ho CM. A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN. In Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems: An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE. 1997. p. 465-470. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/memsys.1997.581894

A FLEXIBLE MEMS TECHNOLOGY AND ITS FIRST APPLICATION TO SHEAR STRESS SENSOR SKIN

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