TY - GEN
T1 - A dual-band filter using Stepped-Impedance Resonator (SIR) embedded into Substrate Integrated Waveguide (SIW)
AU - Wu, Lin-Sheng
AU - Mao, Jun-Fa
AU - Yin, Wen-Yan
AU - Guo, Yong-Xin
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2010
Y1 - 2010
N2 - A new hybrid-integrated dual-band filter is proposed for WLAN application, where the lower passband is implemented by a pair of stepped-impedance resonators (SIRs) and the higher passband is provided by two substrate integrated waveguide (SIW) cavities. In our design, the SIRs are embedded into the SIWs to reduce the size. The relationship between the parasitic resonances of SIW structure and the locations of its transmission zeros is studied. Its good performances have been demonstrated by the simulated and measured S-parameters.
AB - A new hybrid-integrated dual-band filter is proposed for WLAN application, where the lower passband is implemented by a pair of stepped-impedance resonators (SIRs) and the higher passband is provided by two substrate integrated waveguide (SIW) cavities. In our design, the SIRs are embedded into the SIWs to reduce the size. The relationship between the parasitic resonances of SIW structure and the locations of its transmission zeros is studied. Its good performances have been demonstrated by the simulated and measured S-parameters.
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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-79851474456&origin=recordpage
U2 - 10.1109/EDAPS.2010.5683025
DO - 10.1109/EDAPS.2010.5683025
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 9781424490684
T3 - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
BT - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
T2 - 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010
Y2 - 7 December 2010 through 9 December 2010
ER -