A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Keyphrases

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Integrated Circuits Keyphrases
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Image-based Keyphrases
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Data-driven Methods Keyphrases
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Automatic Inspectio... Keyphrases
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Wire Bonding Defect... Keyphrases
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Detection System Keyphrases
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Data Preprocessing Keyphrases
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Classification Mode... Keyphrases
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X-ray Images Keyphrases
50
Convolutional Neura... Keyphrases
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Vision-based Detect... Keyphrases
25
Semiconductors Keyphrases
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Computational Study Keyphrases
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Mainland China Keyphrases
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Product Quality Keyphrases
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Comparative Analysi... Keyphrases
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Geometric Features Keyphrases
25
Identification Algo... Keyphrases
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Feature Extracting Keyphrases
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Segmentation Algori... Keyphrases
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Packaging Process Keyphrases
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Feature Classificat... Keyphrases
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Data Mining Techniq... Keyphrases
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Image Patch Keyphrases
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Feature Engineering Keyphrases
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SVM Model Keyphrases
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Integrated Circuit ... Keyphrases
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Wire Segments Keyphrases
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Chip Classification Keyphrases
25
Chip Identification Keyphrases
25
Segmented Wire Keyphrases
25
Image Chips Keyphrases

INIS

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inspection INIS
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defects INIS
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bonding INIS
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images INIS
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data INIS
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wires INIS
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integrated circuits INIS
66
classification INIS
33
algorithms INIS
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detection INIS
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processing INIS
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x radiation INIS
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vision INIS
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neural networks INIS
16
semiconductor mater... INIS
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engineering INIS
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china INIS
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geometry INIS
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availability INIS
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mining INIS
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benchmarks INIS
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packaging INIS

Engineering

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Inspection Engineering
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Bonding Wire Engineering
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Images Engineering
100
Integrated Circuit Engineering
60
Model Engineering
40
Detection System Engineering
40
Data Preprocessing Engineering
40
Algorithm Engineering
40
Convolutional Neura... Engineering
20
Engineering Engineering
20
Product Quality Engineering
20
Mining Engineering
20
Benchmark Engineering
20
Comparative Analysi... Engineering
20
Geometric Feature Engineering
20
Image Patch Engineering
20
Raw Image Engineering
20
Semiconductor Mater... Engineering
20
Industrial Plant Engineering
Research OutputsResearch Output authored by A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects is tagged with the concept