A comparison of the strength of multilayers, thin films and nanocrystalline compacts

Research output: Journal Publications and Reviews › RGC 62 - Review of books or of software (or similar publications/items) › peer-review

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Author(s)

  • F. Spaepen
  • D. Y W Yu

Detail(s)

Original languageEnglish
Pages (from-to)729-732
Journal / PublicationScripta Materialia
Volume50
Issue number6
Publication statusPublished - Mar 2004
Externally publishedYes

Link(s)

DOI

DOI
Check@CityULib
Link to Scopus https://www.scopus.com/record/display.uri?eid=2-s2.0-0347759956&origin=recordpage
Permanent Link https://scholars.cityu.edu.hk/en/publications/publication(d825719f-8590-4c55-90bd-d7b43ff039ef).html

Abstract

A survey of the yield strength and hardness of copper-based materials shows a progressive lowering of the strength with respect to the extrapolation of the Hall-Petch relation as the length scale of the microstructure decreases. The overall trend can be modeled by scaling the elastic screening length for the dislocation line tension with the microstructural length scale, as proposed by Scattergood and Koch. © 2003 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Research Area(s)

  • Multilayers, Nanocrystalline materials, Size effects, Thin films, Yield phenomena

Fingerprint

Publication fingerprints text

100
Microstructure Keyphrases
100
Nanocrystalline Keyphrases
100
Yield Strength Keyphrases
100
Dislocation Line Keyphrases
100
Hall-Petch Relation... Keyphrases
100
Multilayer Thin Fil... Keyphrases
100
Screening Length Keyphrases
100
Overall Trends Keyphrases
100
Microstructural Len... Keyphrases
100
Line Tension Keyphrases
Full Fingerprint ›

Citation Format(s)

[ RIS ] [ BibTeX ]
A comparison of the strength of multilayers, thin films and nanocrystalline compacts. / Spaepen, F.; Yu, D. Y W.
In: Scripta Materialia, Vol. 50, No. 6, 03.2004, p. 729-732.

Research output: Journal Publications and Reviews › RGC 62 - Review of books or of software (or similar publications/items) › peer-review