A COMPARISON OF THE DIMPLE SPACING ON INTERGRANULAR CREEP FRACTURE SURFACES WITH THE SLIP BAND SPACING FOR COPPER

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)365-368
Journal / PublicationScripta Metallurgica
Volume14
Issue number3
Publication statusPublished - Mar 1980
Externally publishedYes

Abstract

We have shown that the dimple spacing on intergranular creep fracture surfaces of copper coincides with the slip band spacing and that both quantities are inversely proportional to the applied stress. This correlation between slip band formation and cavity nucleation suggests that cavities may be nucleated by a process involving the intersection of slip bands and grain boundaries. © 1980.