A Combined Molecular Dynamics and Finite Element Analysis of Contact and Adhesion of a Rough Sphere and a Flat Surface

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • H. Eid
  • G. G. Adams
  • N. E. Mcgruer
  • A. Fortini
  • S. Buldyrev

Detail(s)

Original languageEnglish
Pages (from-to)920-928
Journal / PublicationTribology Transactions
Volume54
Issue number6
Publication statusPublished - 12 Oct 2011
Externally publishedYes

Abstract

A combined molecular dynamics and finite element model and simulation of contact and adhesion between a rough sphere and a flat surface has been developed. This model uses the results of molecular dynamics (MD) simulations, obtained using an embedded atom potential, of a nanoscale Ru-Ru asperity contact. A continuum finite element model of an elastic–plastic microscale Ru-Ru contact bump is then created. In this model, the surface roughness is represented by a system of nanoscale asperities, each of which is represented by a nonlinear hysteretic force vs. distance relationship. The nonlinear hysteretic character of these relations is determined from curve-fits of the MD results. Load vs. interference and contact area vs. interference are determined using this two-scale model for loading and unloading. Comparisons with a single-scale continuum model show that the effect of the nanoscale asperities is to reduce both the adhesion and the real area of contact. The choice of Ru as the material for this work is due to its relevance in microswitches.

Research Area(s)

  • Adhesion, Contact Mechanics, Stiction

Citation Format(s)

A Combined Molecular Dynamics and Finite Element Analysis of Contact and Adhesion of a Rough Sphere and a Flat Surface. / Eid, H.; Adams, G. G.; Mcgruer, N. E.; Fortini, A.; Buldyrev, S.; Srolovitz, D.

In: Tribology Transactions, Vol. 54, No. 6, 12.10.2011, p. 920-928.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review