@inproceedings{1d159946233c47ffb57951a2e6e0b3da,
title = "A Broadband, Via-Less, and Reusable Characterization Method for Advanced Packaging Materials with Multimode Gap Waveguide Resonator",
abstract = "A broadband, via-less, and reusable multimode resonant complex permittivity measurement method for advanced packaging materials based on gap waveguide is presented in this paper. By feeding energy from a standard rectangular waveguide of W-band through a coupling slot at both ends of a gap waveguide resonator, the quasi-TE10k mode is excited at different frequencies inside the resonator. The gap waveguide resonator is properly designed for operating frequency and multimode measurement. And the complex permittivity can be extracted from the resonant frequency and quality factor of the resonator. The calibration for electromagnetic band gap (EBG) leakage, metal loss, and processing errors can also be achieved by measuring the Sparameter of the resonator without the dielectric film. An example of 100 um thick polyimide (PI) characterization is given. {\textcopyright} 2022 IEEE.",
keywords = "broadband measurement, dielectric constant, dielectric loss tangent, gap waveguide, multimode measurement, via-less",
author = "Song, {Xiao Xuan} and Wu, {Ya Fei} and Yongxin Guo and Cheng, {Yu Jian}",
year = "2022",
month = nov,
doi = "10.1109/IMWS-AMP54652.2022.10107181",
language = "English",
isbn = "9781665478359",
series = "IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP - Proceedings",
publisher = "IEEE",
booktitle = "IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2022) - Proceedings",
address = "United States",
note = "2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2022), IEEE MTT-S IMWS-AMP 2022 ; Conference date: 12-12-2022 Through 14-12-2022",
}