3D thermoelasticity solutions for functionally graded thick plates

Engineering

• Thick Plate 100%
• Boundary Condition 66%
• Thermal Conductivity 33%
• Thin Plate 33%
• Hybrid Approach 33%
• Simply Supported Edge 33%
• Constant Coefficient 33%
• Micromechanics 33%
• Thickness Direction 33%
• Bulk Modulus 33%
• State-Space Methods 33%
• Shear Modulus 33%
• Effective Coefficient of Thermal Expansion 33%
• Temperature Distribution 33%
• Equations of State 33%

Material Science

• Volume Fraction 100%
• Elastic Moduli 100%
• Thermoelasticity 100%
• Thermal Expansion 50%
• Thermal Conductivity 50%
• Micromechanics 50%
• Materials Property 50%