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電子組件封裝用複合材料及其製造方法

Translated title of the contribution: 电子组件封装用复合材料及其制造方法 (Electronic Packaging Polymeric Composite And Its Production Method)

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

Translated title of the contribution电子组件封装用复合材料及其制造方法 (Electronic Packaging Polymeric Composite And Its Production Method)
Original languageChinese (Traditional)
Publication statusAccepted/In press/Filed - 22 May 2024

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