Abstract
For the new lead-free solders research in China during the past decade, the research status and development trend of lead-free solders were reviewed synthetically. First of all, it is imperative to discuss the behaviors of different lead-free solder, and the effect of alloying, particles strength and nanominiaturization on lead-free solders. Secondly, the fluxes for lead-free solders were also reviewed and the research development of new flux was discussed. Thirdly, the applications of lead-free solders in electronic industry were remarked, and the related reliability issues were discussed. Lastly the future progress of lead-free solders was prospected, the issues of the lead-free solders were analyzed and some measures were shown for solving these problems, which can provide the theoretical reference for the lead-free solders.
| Translated title of the contribution | Development of lead-free solders in China during the past decade |
|---|---|
| Original language | Chinese (Simplified) |
| Pages (from-to) | 767-790 |
| Journal | Zhongguo Kexue Jishu Kexue/Scientia Sinica Technologica |
| Volume | 46 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 1 Aug 2016 |
| Externally published | Yes |
Research Keywords
- Alloying
- Lead-free solder
- Nanominiaturization
- Particle strength
- Reliability
- 无铅钎料
- 合金化
- 颗粒强化
- 纳米化
- 可靠性
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