Skip to main navigation Skip to search Skip to main content

納米壓印半導體制造中的加工誤差檢測方法、裝置及設備

Translated title of the contribution: ​ Method for Calibrating Processing Errors Enabled by Bound State in the Continuum in Nanoimprint Manufacturing of Semiconductor Devices​

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

Translated title of the contribution​ Method for Calibrating Processing Errors Enabled by Bound State in the Continuum in Nanoimprint Manufacturing of Semiconductor Devices​
Original languageChinese (Traditional)
Publication statusAccepted/In press/Filed - 15 Oct 2024

Permanent Link

Cite this