| Original language | Chinese (Traditional) |
|---|---|
| Publication status | Accepted/In press/Filed - 11 Nov 2025 |
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用於將鈷填充到半導體晶片的穿孔中的方法
- Yingxia LIU (Inventor)
- , Zishan XIONG (Inventor)
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)