Abstract
The interface reaction between the Cu substrate and two lead-free solders of SnAgCu and SnAgCu-TiO2 was investigated, and the growth of intermetallic compounds (IMCs) and mechanical properties of solder joints during aging at 140 °C were analyzed systematically. The results indicate that Cu6Sn5 was detected at the as-soldered interface, and aging at 140 °C resulted in the growth of IMCs. Moreover, it was found that the thickness of IMCs was proportional to the square root of aging time. When the aging time was 300 h, Cu3Sn appeared at the interface, and the results show that the addition of TiO2-nanoparticles could inhibit the growth of IMCs. In addition, after analyzing the mechanical properties of solder joints, it was found that with the development of aging time, the average tensile force decreased obviously, and the mechanical properties of the joint soldered with SnAgCu-TiO2 were higher than that with SnAgCu.
| Translated title of the contribution | Effect of aging on the interface and properties of SnAgCu/SnAgCu-TiO2 solder joints |
|---|---|
| Original language | Chinese (Simplified) |
| Pages (from-to) | 43-46 |
| Journal | Hanjie Xuebao/Transactions of the China Welding Institution |
| Volume | 34 |
| Issue number | 8 |
| Publication status | Published - Aug 2013 |
| Externally published | Yes |
Research Keywords
- Interface reaction
- Intermetallic compound
- Lead-free solders
- Mechanical property
- 无铅钎料
- 界面反应
- 金属间化合物
- 力学性能