Project Details
Description
Many of industrial processes, like IC cure process in semiconductor packaging industry, are spatially
distributed dynamic systems. This kind of process is very difficult to model, design and control due
to the inherent spatio-temporal dynamics. On the other hand, process design and control have long
been separated into two different disciplines in both academia and industry. This separation has made
it difficult to achieve an optimal solution to industrial productions, and even more difficult and
challenging for the spatially distributed dynamic process.We aim to develop a novel model-based optimal design for distributed control of the IC cure oven
under the space/time separation framework. First, the design variable will be considered first time in
the time-space separation to develop a parametric model framework of the cure process.Through the
model-based optimal design, the process can be designed to have a linear dominant dynamics with
the minimized nonlinearity. This design will also result in a good model for the subsequent
decoupling control.Using the linear nominal model, the observer-based decoupling mechanism can
be designed to suppress the model-process mismatch and the external disturbance, so that the process
can be transformed approximately into a linear system. This approximate linear system may match
better with time-space separation for the purpose of easy control.By fine-tuning the nominal modeland setpoints of control loops, the near optimal cure profile can be achieved and maintained over the
entire spatial domain.
| Project number | 9041776 |
|---|---|
| Grant type | GRF |
| Status | Finished |
| Effective start/end date | 1/01/13 → 16/03/17 |
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