Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits

Project: Research

Barrier effect of Sn-Bi-In multi-principal element solder on thermomigration
Yao, Y., Mao, X., Gusak, A. M., Xie, L., Duan, Y., Sun, Q., Li, A., Qi, J., Wang, W., He, Q. & Liu, Y., Mar 2026, In: Materials Science and Engineering: A. 956, 149916.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
1 Link opens in a new tab Citation (Scopus)
h-BN-based lamellar films with ultralow dielectric constant and high thermal conductivity
Shen, Z., Wang, K., Chen, Y., Mao, X., Xie, S. & Liu, Y., Jan 2026, In: Materials and Design. 261, 115323.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Open Access
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4 Downloads (CityUHK Scholars)
Interface Engineering Suppresses Self-Annealing in Electroplated Nanograined Copper for Low-Temperature Copper-to-Copper Bonding
Peng, G. (Co-first Author), Dong, X. (Co-first Author), Li, B. (Co-first Author), He, C., Chen, C., Huang, L., Liu, J., Zhou, Y., Li, Q., Gong, H., Wang, Y., Mu, K., Cherng, S.-J., Yang, P.-Y., Lu, Y., Yang, Y., Hung, S.-W. & Feng, S.-P., 4 Jan 2026, (Online published) In: Advanced Science. 10 p., e21964.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Open Access
File
3 Link opens in a new tab Citations (Scopus)

15 Downloads (CityUHK Scholars)

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