Research output per year
Research output per year
Project Details
| Project number | 8730084 |
|---|---|
| Grant type | YCRG |
| Status | Active |
| Effective start/end date | 1/06/23 → … |
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Research output
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A mixed crystal structure for the investigation of Cu-Cu bonding
Xie, S., Xiong, Z. & Liu, Y., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026). IEEE, p. 140-141 2 p. (International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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Barrier effect of Sn-Bi-In multi-principal element solder on thermomigration
Yao, Y., Mao, X., Gusak, A. M., Xie, L., Duan, Y., Sun, Q., Li, A., Qi, J., Wang, W., He, Q. & Liu, Y., Mar 2026, In: Materials Science and Engineering: A. 956, 149916.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
1 Link opens in a new tab Citation (Scopus) -
Defects in Cu-filled through-silicon vias (TSV) after thermal cycling
Xiong, Z., Xie, S., Li, Z., Li, Z., Zhang, Z., Liu, S., Guo, Y. & Liu, Y., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026). IEEE, p. 299-300 2 p. (International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review