Investigation of Wideband Antenna-In-Package Designs for 6G Communications
DescriptionAntenna in package (AiP) or antenna on package (AoP) technologies are of key importance to wireless devices operating at millimeter-wave and terahertz frequencies. These technologies allow antenna integration associated with other radio-frequency modules to become small and compact front-ends in sensors, wireless wearables, security cameras, radars in vehicles, Internet of Things (IoT) wireless devices, and communications products. Global ICT leaders forecast over a billion millimeter-wave and terahertz products will be produced in coming years. The high-frequency (millimeter-wave and terahertz) technology market is expected to reach 4.7 billion USD by 2026 with a compound annual growth rate of 20.8% from 2021 to 2026.There are some inveterate challenges, however, still to be solved to accomplish the full potential of AiP technology. For example, antennas' bandwidth and radiation performance may be degraded after the packaging process due to different materials in fabrication within the process. The interconnections of the solder balls between the antenna and the radio-frequency modules may be deformed, which causes impedance changes for the antenna input port, narrower the bandwidth of the antennas, and lower the radiating gain of the antenna. These factors cause low reliability in high-frequency AiP designs and unstable radiation patterns across the bandwidth of the AiP. Scientists and engineers are now looking for high-performance, high-reliability, and wideband AiP solutions for tackling these major obstacles for millimeter-wave and terahertz communications.This research project aims to investigate novel antenna designs to tackle the bottleneck for millimeter-wave and terahertz AiPs by introducing wideband, high-gain, cost-effective antenna solutions for such high-frequency applications. Our devoted antenna technologies will support the needs of emerging and future wireless systems at 6G and beyond. Three identified project objectives will be carried out. Firstly, we will introduce a new wideband antenna element for high-frequency AiP design. The solution uses the resonances from two electric dipoles and a magnetic dipole to obtain wideband and high-quality radiation performance for the AiP. Secondly, a wideband end-fire AiP design will be investigated. This invention suggests multiple resonances at an aperture of AiP to achieve stable and wideband end-fire radiation with a high front-to-back ratio across the entire operating bandwidth. Finally, an AiP used to excite a planar lens formed by a partially-reflective-surface and a metasurface to produce directive-beam radiations will be demonstrated. The approach of using a low-temperature-cofired-ceramic (LTCC) wideband antenna packaged as the AiP source finds effectively to make condensed electric field distribution on the planar lens such that a high-gain radiation pattern can be achieved. The outputs of this project will deliver state-of-the-art high-frequency antenna solutions for millimeter-wave and terahertz AiP technologies to support existing and future wireless communication systems. They will benefit academic and industrial communities in Hong Kong, the greater bay area, and across the globe.
|Effective start/end date||1/01/23 → …|