Investigation of Antenna Design and Electromagnetic Compatibility in Radio-Frequency System-in-Package

Project: Research

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With the rapid development of wireless communications, it has been a trend to integrate the antenna with RF module, which is known as antenna-in-package (AiP). Using this approach, wireless systems can be made smaller in size, lower in cost, and more efficient in power consumption. However, the current AiP technology is not mature and improvements in the antenna gain, radiation pattern, and electromagnetic interference are needed. The idea of RF system-in-package (RF-SiP) is becoming popular and some research works on the antenna-integrated RF-SiP (AIRF-SiP) have been done. In this project, new antennas for AiP and AIRF-SiP designs along with their electromagnetic compatibility (EMC) will be studied.Normally, the antenna and circuit of AiP/AIRF-SiP designs are arranged horizontally or vertically. In this project, a third arrangement of placing the circuit inside the hollow dielectric resonator antenna (DRA) will also be made. Different new hollow DRAs will be investigated and applied to AiP and AIRF-SiP design, including the linearly polarized DRA, circularly polarized DRA, omnidirectional DRA, differential DRA, and dualband DRA. Their EMC problems will be examined and tackled.The antenna gain of hollow DRA is typically ~ 5-7dBi. In this project, the perforated DRA array will be studied to obtain higher antenna gains. It can be easily fabricated by simply making a lattice of holes on a dielectric substrate. In addition, the millimetre-wave Fabry-Perot resonator antenna (FPRA) will also be used. It has a very simple structure with its gains higher than 10dBi. For the first time, the FPRA will be realized using the LTCC technology. This project will apply the perforated DRA array and FPRA to AiP designs and study their EMC.In the study of EMC, a new Generalized Transition Matrix (GTM) method will be developed to take into account the hybrid effects of electromagnetic, thermal, and stress fields. To facilitate the study, an RF-SiP platform will be built for co-designing the antenna and RF circuit. Also, the electrical and EMC characteristics of the AiP and RF circuit will be determined by developing system-level measurement and testing techniques.The project will be divided into two parts. Part 1 focuses on the AiP/AIRF-SiP designs, which will be carried out at City University of Hong Kong. For Part 2, different EMC problems of the AiP/AIRF-SiP designs will be examined and solved at Shanghai Jiao Tong University. Finally, the co-design and measurement of the antenna and circuit will be jointly conducted.


Project number9054010
Grant typeNSFC
Effective start/end date1/01/1431/12/18