Enhanced Plasma Generation for Plasma Etching of Printed Circuit/Wiring Board
- Paul Kim Ho CHU (Principal Investigator / Project Coordinator)Department of Physics
- Ho Sum Samson CHENG (Co-Investigator)
- Tat Kun KWOK (Co-Investigator)
DescriptionElectronic packaging was once the major industry in Hong Kong. A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. The most fundamental and essential process/step for high quality fabrication is etching and/or cleaning process. Plasma cleaning and pre-treatment of substrates prior to wire bond and epoxy mould is a common standard. The aim of the project is to enhance plasma generation for cleaning/etching large area printed circuit/wiring boards. This project will encourage manufacturers to establish research base in Hong Kong and provide employment opportunities for Hong Kong citizens.
|Effective start/end date||2/10/13 → 1/10/14|