Project Details
Description
Electronic packaging was once the major industry in Hong Kong. A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. The most fundamental and essential process/step for high quality fabrication is etching and/or cleaning process. Plasma cleaning and pre-treatment of substrates prior to wire bond and epoxy mould is a common standard. The aim of the project is to enhance plasma generation for cleaning/etching large area printed circuit/wiring boards. This project will encourage manufacturers to establish research base in Hong Kong and provide employment opportunities for Hong Kong citizens.
| Project number | 9440105 |
|---|---|
| Grant type | ITF |
| Status | Finished |
| Effective start/end date | 2/10/13 → 1/10/14 |
Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.