Development of Nano-particles Doped Pb-Free Composite Solder for Ultra-fine Pitch Interconnection Application

Description

Pb-free solders have attracted extensive research interest because of the legislative restrictions on Pb in electronics. However, some Pb-free solder related drawbacks still exist (such as higher soldering temperature, poor wettability, rough joint appearance, more interfacial reaction, faster atomic-migration, and components being less aligned) that need to be addressed. Any improvement in the performance and reliability of the Pb-free interconnections will be welcomed by the electronics industry.This project plans to improve the wetting attribute, retardation of interfacial reaction, atomic-migration resistance, and mechanical properties of Pb-free solders by doping nanoparticles, such as Ni, Ag, Cu, and others. The wettability, microstructure, mechanical properties, thermal behaviour, electrical characteristics, and atomic-migration of Pb-free solders doped with different nanoparticles will be investigated and compared. The most effective and optimal composite solders will be determined. Successful completion of this project will lead to a new generation of cost-effective, highly reliable and hazardous-free solders for ultra-fine pitch interconnection applications.