Development of 2D Metallic Nanomaterials for Ultra-Efficient Nanomembrane Bonding - RMGS

Description

The next-generation micro- and nano-devices involve the development of novel bonding technologies. To date, traditional bonding methods based on conventional bulk materials are facing challenges as devices become much smaller and thinner. In this proposal, we intend to develop 2D metallic nanomaterials for nanomembrane bonding, which occurs at an interfacial thickness of 10-100 nm but over an area of 1×1 cm2. Because of the extraordinary geometric effect, we have shown that the 2D metallic nanomaterials (even 2D intermetallic and ceramic nanomaterials) are not only strong but also ductile, some of which can show excellent electric conductivities. In addition, the melting or softening temperatures of these 2D metallic nanomaterials reduce with decreasing thickness, which can even reach room temperature to enable atomic diffusion and nanomembrane bonding at temperatures and pressures much lower than in traditional bonding methods. If this proposal was funded, we would like to develop novel 2D nanomaterials among the selected metals (e.g., 2D Sn, 2D Cu, 2D Au and 2D Ag) for nanomembrane bonding at interfaces of technologic relevance (e.g., copper-copper or SiC-SiC).