Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA)

Description

The Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering Centre was established in July 1998 and aims to provide turnkey full services to the electronics manufacturing industries. These include applied R&D, technology transfer, open-access laboratory, consultancy and manpower training. In February 2000, the Centre acquired the status of Applied Strategic Development Centre (ASDC) in the University to become a focal point to nurture applied R&D in advanced electronic packaging and assemblies. It holds the most comprehensive range of equipment worth over $20 million, the first of its kind in a local tertiary institution, providing indispensable support to our activities in academic research and applied R&D. Backed by CityU's strong academic research support and excellent collaboration with both local and overseas research centres, the ASDC has demonstrated excellent results in the applications of midstream R&D and providing valuable services to the industry.