Prize / Honour: Prizes and awards (RGC: 64B)64B_Prizes and awards

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The Young Professionals & Student Activity Committee (YPS-AC) of the Industrial Electronics Society (IES) offers financial support to the IEEE IES Student members to attend IES conferences. We have pre-allocated 53 IES Student and Young Professionals Paper Assistances (IES-SYPA) up to US$2000 each for conferences in this year. It should be pointed out that in the case of a large number of applicants having obtained a high score, the committee can reduce the travel assistance amount to US$1000 per applicant. This exceptional measure is in order to support the travel of higher number of excellent applicants. On the other hand, the number of the IES-SYPAs for the IECON or other conferences could be increased to follow the need, within budget capability. In this year for the IEEE INDIN'19 we have received 12 applications for the IEEE IES STUDENT & YOUNG PROFESSIONALS PAPER ASSISTANCE (IES-SYPA). The average weighted score is 6.88. We would like to announce 5 IES-SYPA (recognition diploma plus up-to USD 2000 travel costs reimbursement) recipients (see the table below). Congratulations to all the winners.


Awarded date24 Jul 2019
Degree of recognitionInternational
Granting OrganisationsIEEE Industrial Electronics Society (IEEE-IES)
Awarded at event17th IEEE International Conference on Industrial Informatics (INDIN2019)