Bronze Medal at the 49th International Exhibition of Inventions of Geneva
Prize / Honour: Prizes and awards (RGC: 64B) › 64B_Prizes and awards
Recipient(s)
- King Ning TU (Recipient)
- Yingxia LIU (Recipient)
- Chang CHEN (Recipient)
Related research unit(s)
Description
The Project "Thermomigration Creep for Enhanced Cu-Cu Direct bonding" won the Bronze Medal at the 49th International Exhibition of Inventions of Geneva (IEIG).
IEIG, an annual event dedicated to inventions, provides a unique opportunity for inventors and researchers to present the results of their research and their new products.
Detail(s)
| Awarded date | Apr 2024 |
|---|---|
| Degree of recognition | International |
| Granting Organisations | The 49th International Exhibition of Inventions of Geneva |
