The Project "Thermomigration Creep for Enhanced Cu-Cu Direct bonding" won the Bronze Medal at the 49th International Exhibition of Inventions of Geneva (IEIG).
IEIG, an annual event dedicated to inventions, provides a unique opportunity for inventors and researchers to present the results of their research and their new products.
Awarded date
Apr 2024
Degree of recognition
International
Granting Organisations
The 49th International Exhibition of Inventions of Geneva