Research output per year
Research output per year
Personal profile
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Dive into the research topics where Zishan XIONG is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations from the last five years
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Research output
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A mixed crystal structure for the investigation of Cu-Cu bonding
Xie, S., Xiong, Z. & Liu, Y., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026). IEEE, p. 140-141 2 p. (International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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Defects in Cu-filled through-silicon vias (TSV) after thermal cycling
Xiong, Z., Xie, S., Li, Z., Li, Z., Zhang, Z., Liu, S., Guo, Y. & Liu, Y., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026). IEEE, p. 299-300 2 p. (International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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Fast Cu-Cu pillar array bonding by thermally stable nanocrystalline Cu
Ye, Z.-T. (Co-first Author), Xie, S. (Co-first Author), Duan, Y., Mao, X., Xiong, Z., Du, F., He, Q. & Liu, Y., 1 Jul 2026, In: Applied Surface Science. 733, 7 p., 166605.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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The study of rapid Cu–Cu bonding using thermally stable nanostructured Cu layers
Xie, S., Xiong, Z., Ye, Z., Duan, Y., Du, F., Tu, K. N. & Liu, Y., 1 Mar 2026, In: Applied Surface Science. 721, 9 p., 165382.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile4 Link opens in a new tab Citations (Scopus)2 Downloads (CityUHK Scholars) -
Electrodeposition Fabrication and Mechanical Properties Study of Ag–Zn Solid Solution Films
Wang, C., Xiong, Z., Wu, X. & Zhao, X., 2025, 2025 26th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 6 p.Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review