ZHU Ze (朱澤)
Research Output
- 2019
- Published
Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect
Zhu, Z., Chan, Y. & Wu, F., Jan 2019, In: Microelectronics Reliability. 92, p. 12-19Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 12 - 2018
- Published
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing
Zhu, Z., Chan, Y. & Wu, F., Dec 2018, In: Microelectronics Reliability. 91, p. 179-182Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 14 - Published
Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
Zhu, Z., Chan, Y., Chen, Z., Gan, C. & Wu, F., 6 Jun 2018, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 727, p. 160-169Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 50 - 2017
- Published
Environmental impact analysis of smartwatch using SimaPro8 tools and energy dispersive X-ray spectroscopy (EDX) technique
Ma, M. M. M., Zhu, Z. & Chan, Y. C., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE, p. 1-6Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Scopus citations: 3 - Published
Reliability of wearable electronics-Case of water proof tests on smartwatch
Yip, Y. Z., Zhu, Z. & Chan, Y., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEEResearch output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Scopus citations: 6 - Published
Review on test vehicles for electromigration (EM) study in solder interconnects
Zhu, Z., Chan, Y., Wu, F., Gan, C. L. & Chen, Z., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEEResearch output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Scopus citations: 1 - Published
Reliability analysis of smartwatch
Yip, Y. N. Z., Zhu, Z. & Chan, Y. C., Aug 2017, Proceedings - 2017 18th International Conference on Electronic Packaging Technology (ICEPT). Ye, T., Tian, Y. & Wang, C. (eds.). IEEE, p. 1011-1015Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Scopus citations: 4 - Published
Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)
Zhu, Z., LI, Y., Chan, Y. C. & Wu, F., Jun 2017, In: Journal of Materials Science: Materials in Electronics. 28, 12, p. 8717-8724Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 5 - 2016
- Published
Enhanced electromigration (EM) reliability of Sn58Bi solder due to the incorporation of ZrO2 nanoparticles
Zhu, Z., Li, Y., Wu, F. & Chan, Y., 1 Dec 2016, 2016 6th Electronic System-Integration Technology Conference, ESTC 2016. Institute of Electrical and Electronics Engineers Inc., 7764722Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
- Published
Investigation in microstructure and mechanical properties of Ni-coated multi-wall carbon nanotubes doped Sn3.0Ag0.5Cu solder alloys
Xiao, H., Chan, Y., Zhu, Z. & Wu, F., Sept 2016, Electronic System-Integration Technology Conference (ESTC), 2016 6th. IEEE, 7764686Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Scopus citations: 1 - Published
Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods
Zhu, Z., Sun, H., Wu, F. & Chan, Y., Jul 2016, In: Journal of Materials Science: Materials in Electronics. 27, 7, p. 6835-6844Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 14 - 2015
- Published
Electromigration study of SnCu0.7 solder joints with Ag added by different methods
Zhu, Z., Sun, H., Chan, Y. & Wu, F., Dec 2015, Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 7412350Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Scopus citations: 1 - Published
Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint
Zhu, Z., Chan, Y. & Wu, F., Aug 2015, Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, p. 140-143 7236561Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with host publication) › peer-review
Scopus citations: 5
