ZHU Ze (朱澤)

Research Output

  1. 2019
  2. Published

    Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

    Zhu, Z., Chan, Y. & Wu, F., Jan 2019, In : Microelectronics Reliability. 92, p. 12-19

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 2
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  3. 2018
  4. Published

    Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing

    Zhu, Z., Chan, Y. & Wu, F., Dec 2018, In : Microelectronics Reliability. 91, p. 179-182

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 1
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  5. Published

    Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder

    Zhu, Z., Chan, Y., Chen, Z., Gan, C. & Wu, F., 6 Jun 2018, In : Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 727, p. 160-169

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 7
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  6. 2017
  7. Published

    Environmental impact analysis of smartwatch using SimaPro8 tools and energy dispersive X-ray spectroscopy (EDX) technique

    Ma, M. M. M., Zhu, Z. & Chan, Y. C., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE, p. 1-6

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Check@CityULib
  8. Published

    Reliability of wearable electronics-Case of water proof tests on smartwatch

    Yip, Y. Z., Zhu, Z. & Chan, Y., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Scopus citations: 3
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  9. Published

    Review on test vehicles for electromigration (EM) study in solder interconnects

    Zhu, Z., Chan, Y., Wu, F., Gan, C. L. & Chen, Z., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Scopus citations: 1
    Check@CityULib
  10. Published

    Reliability analysis of smartwatch

    Yip, Y. N. Z., Zhu, Z. & Chan, Y. C., Aug 2017, Proceedings - 2017 18th International Conference on Electronic Packaging Technology (ICEPT). Ye, T., Tian, Y. & Wang, C. (eds.). IEEE, p. 1011-1015

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Scopus citations: 1
    Check@CityULib
  11. Published

    Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

    Zhu, Z., LI, Y., Chan, Y. C. & Wu, F., Jun 2017, In : Journal of Materials Science: Materials in Electronics. 28, 12, p. 8717-8724

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 3
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  12. 2016
  13. Published

    Enhanced electromigration (EM) reliability of Sn58Bi solder due to the incorporation of ZrO2 nanoparticles

    Zhu, Z., Li, Y., Wu, F. & Chan, Y., 1 Dec 2016, 2016 6th Electronic System-Integration Technology Conference, ESTC 2016. Institute of Electrical and Electronics Engineers Inc., 7764722

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Check@CityULib
  14. Published

    Investigation in microstructure and mechanical properties of Ni-coated multi-wall carbon nanotubes doped Sn3.0Ag0.5Cu solder alloys

    Xiao, H., Chan, Y., Zhu, Z. & Wu, F., Sep 2016, Electronic System-Integration Technology Conference (ESTC), 2016 6th. IEEE, 7764686

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Scopus citations: 1
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  15. Published

    Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

    Zhu, Z., Sun, H., Wu, F. & Chan, Y., 9 Mar 2016, In : Journal of Materials Science: Materials in Electronics. 27, 7, p. 6835-6844

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 9
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  16. 2015
  17. Published

    Electromigration study of SnCu0.7 solder joints with Ag added by different methods

    Zhu, Z., Sun, H., Chan, Y. & Wu, F., Dec 2015, Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 7412350

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Scopus citations: 1
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  18. Published

    Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint

    Zhu, Z., Chan, Y. & Wu, F., Aug 2015, Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, p. 140-143 7236561

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)Not applicablepeer-review

    Scopus citations: 3
    Check@CityULib