Research output per year
Research output per year
Personal profile
Author IDs
ORCID iD: 0000-0003-0482-3904
Scopus Author ID: 56382039000
Google Scholar Profile: W9uJi-8AAAAJ
Impact
Qualifications (Brief)
BS (Peking University), PhD (UCLA)
Biography
Dr. Yingxia Liu is currently an assistant professor at City University of Hong Kong. Before joining CityU, Dr. Liu worked at Intel as a Quality and Reliability R&D Engineer, in charge of solving the reliability issues related to Intel’s latest packaging technology. Dr. Liu received her Ph.D. from the Department of Materials Science and Engineering, University of California, Los Angeles, and a bachelor’s degree from the College of Chemistry and Molecular Engineering, Peking University in 2012.
Dr. Liu’s primary research interest is in the technology and reliability study of 3D integration circuit (3D IC). By developing ultra-high-density interconnect technology, Dr. Liu is trying to integrate carbon nanotube field effect transistors three-dimensionally. Her recent research extends to the design of AI processor based on 3D IC technology. Dr. Liu also focuses on the reliability science of interconnects in chip and packaging technology, including the flux-driving kinetics in the interconnects, Joule heating and heat dissipation, and thermal stress analysis and mitigation.
Research Interests/Areas
- 3D Integrated Circuit (3D IC) technology
- High-density Integration
- AI processor design based on 3D IC hardware
- Packaging reliability
- Flux-driven kinetics
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 3 Good Health and Well-being -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure
Fingerprint
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- 1 Similar Profiles
Collaborations from the last five years
Recent external collaboration based on locations. Dive into details by clicking on the dots or
Research output
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A mixed crystal structure for the investigation of Cu-Cu bonding
Xie, S., Xiong, Z. & Liu, Y., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026). IEEE, p. 140-141 2 p. (International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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Barrier effect of Sn-Bi-In multi-principal element solder on thermomigration
Yao, Y., Mao, X., Gusak, A. M., Xie, L., Duan, Y., Sun, Q., Li, A., Qi, J., Wang, W., He, Q. & Liu, Y., Mar 2026, In: Materials Science and Engineering: A. 956, 149916.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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Decentralized Three-Dimensional Artificial Intelligence Processor And Redictive Coding Method Of Processing Data Therein
LIU, Y. (Inventor) & CHEN, Y. (Inventor), 6 Mar 2026, (Accepted/In press/Filed) Priority No. 63/998,097Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)
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Defects in Cu-filled through-silicon vias (TSV) after thermal cycling
Xiong, Z., Xie, S., Li, Z., Li, Z., Zhang, Z., Liu, S., Guo, Y. & Liu, Y., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026). IEEE, p. 299-300 2 p. (International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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Degradation process modeling and data-driven lifetime prediction for BGA specimen during small sample electromigration test
Li, P., Wen, M., Lio, W., Liu, Y. & Kang, R., Mar 2026, In: Reliability Engineering and System Safety. 267, Part B, 23 p., 111953.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
3 Link opens in a new tab Citations (Scopus)
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GRF: Investigation of Surface Oxidation Resistance for High Entropy Solder Particles
LIU, Y. (Principal Investigator / Project Coordinator) & HE, Q. (Co-Investigator)
1/01/25 → …
Project: Research
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NSFC: Multi-scale Inverse Design and Experimental Verification of High-entropy Solder
LIU, Y. (Principal Investigator / Project Coordinator), GUO, Y. (Co-Investigator), LIU, S. (Co-Investigator) & TU, K. N. (Co-Investigator)
1/01/24 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), TU, K. N. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), FENG, S. P. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), LIU, Y. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
Prizes
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2024 IEEE EPS Outstanding Young Engineer Award
LIU, Y. (Recipient), Apr 2024
Prize: RGC 64B - Prizes and awards
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Bronze Medal at the 49th International Exhibition of Inventions of Geneva
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2024
Prize: RGC 64B - Prizes and awards
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Silver Medal at 2023 International Exhibition of Inventions Geneva (IEIG)
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2023
Prize: RGC 64B - Prizes and awards
Press/Media
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CityU’s record-breaking showing at International Exhibition of Inventions Geneva
LAU, C., LEUNG, M. Y. K., HILL, F. I., PANG, S. W., LI, H., WANG, S., YU, X., LEI, D., LI, Y., WU, W., ZHU, Z., TSO, C. Y., ZHANG, W., TU, K. N., LIU, Y., NG, S. T. T., ZHAO, S., LEE, W. M., LAM, H. F., LUO, X., ZHANG, Z., ZHAO, X., YAN, H., XIE, M., ZHU, K., JING, X., HU, J., TSE, C. F. N., LU, J., LAM, H. W. M., LAM, H. W. R., HO, J. C. Y., DAOUD, W., KHOO, B. L., KWONG, T. W. S., LI, X., CHAN, C. H., LUK, K. M., CHU, P. K. H., LO, P. K. P. & ZHI, C.
29/04/23
7 items of Media coverage
Press/Media: Press / Media
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CityUHK triumphs at the International Exhibition of Inventions of Geneva with 36 awards
PANG, S. W., TSE, C. K., FENG, S. P., CHAN, C. H., WU, G., KUO, W., JIANG, C., ZHU, Z., CHUNG, S. H. H., HU, J., CHEN, M. K., TSAI, D.-P., LIN, S. K. C., CHAN, L. L., LU, J., LY, T. H., LI, L., LAU, C., LI, X., HILL, F. I., WANG, C., KO, C. C. V., LEUNG, M. Y. K., YU, K. N. P., LAU, T. C., HO, J. C. Y., SONG, L., WANG, S., TU, K. N., LIU, Y., LU, Z., ZUKERMAN, M., WANG, Y., SUN, Y., YAN, H., LAU, C. K. T. & BAN, K.
20/04/24
7 items of Media coverage
Press/Media: Press / Media
Activities
- 1 RGC 61 - Journal editor
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Frontiers in Materials (Journal)
LIU, Y. (Review Editor)
Jul 2022 → …Activity: Publication peer-review and editorial work (RGC: 61) › RGC 61 - Journal editor
Supervised Students
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Mr. Angmin LI, 李昂民
- Department of Systems Engineering - P/T Research Assistant
Person: P/T Research Assistant, Doctor of Philosophy (Student)
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