Research output per year
Research output per year
Personal profile
Author IDs
Scopus Author ID: 56382039000
Google Scholar Profile: W9uJi-8AAAAJ
Impact
Qualifications (Brief)
BS (Peking University), PhD (UCLA)
Biography
Dr. Yingxia Liu is currently an assistant professor at City University of Hong Kong. Before joining CityU, Dr. Liu worked at Intel as a Quality and Reliability R&D Engineer, in charge of solving the reliability issues related to Intel’s latest packaging technology. Dr. Liu received her Ph.D. from the Department of Materials Science and Engineering, University of California, Los Angeles, and a bachelor’s degree from the College of Chemistry and Molecular Engineering, Peking University in 2012.
Dr. Liu’s primary research interest is in the technology and reliability study of 3D integration circuit (3D IC). By developing ultra-high-density interconnect technology, Dr. Liu is trying to integrate carbon nanotube field effect transistors three-dimensionally. Her recent research extends to 3D integration technology and system engineering for superconducting circuits. Dr. Liu also focuses on the reliability science of interconnects in chip and packaging technology, including the flux-driving kinetics in the interconnects, Joule heating and heat dissipation, and thermal stress analysis and mitigation.
Research Interests/Areas
- 3D integration technology
- Packaging reliability
- Electromigration
- Flux-driven kinetics
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Research output
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A constructable 3D AI Processor system design scheme based on Fine Grain Cube (FGC) Architecture
CHEN, Y. (Inventor) & LIU, Y. (Inventor), 12 Feb 2025, (Accepted/In press/Filed) Priority No. 63/757,697Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)
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A controllable salting-out engineering strategy to promote the anisotropic thermal conductivity performances of BNNS@PVA aerogel-based composites by constructing thermal transfer network
Wang, K., Liu, S., Li, H., Liu, X., Liu, Y. & Liu, H., Aug 2025, In: Composites Communications. 57, 102456.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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A Method For Low-Temperature Copper-To-Copper Bonding Utilizing Nanocrystals
LIU, Y. (Inventor), XIE, S. (Inventor) & YE, Z. (Inventor), 14 Feb 2025, (Accepted/In press/Filed) Priority No. 63/758,872Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)
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Confined Synthesis of 2D Molybdenum Diphosphide Nanosheets via Gas-Solid Transformation
Wang, W., Wu, J., Ma, C., Qi, J., Bao, K., Zhai, L., Repaka, D. V. M., Han, X., Ma, C., Wu, Z., Wang, L., Gong, F., Liu, Y., Chen, Y. & He, Q., 5 Feb 2025, In: Small. 21, 5, 2408782.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints
Yao, Y., Lu, Z., An, Y., Tu, K. N. & Liu, Y., Jan 2025, In: Electronic Materials Letters. 21, 1, p. 134-143Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile1 Citation (Scopus)7 Downloads (CityUHK Scholars)
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GRF: Investigation of Surface Oxidation Resistance for High Entropy Solder Particles
LIU, Y. (Principal Investigator / Project Coordinator) & HE, Q. (Co-Investigator)
1/01/25 → …
Project: Research
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ITF: Development of Thermally Instable Nanograined Cu and Thermally Stable Composite Cu for 3DIC Stacking and Advanced Electronic Packaging Applications
FENG, S. P. (Principal Investigator / Project Coordinator), LIU, Y. (Co-Investigator) & TU, K. N. (Co-Investigator)
1/01/24 → …
Project: Research
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NSFC: Multi-scale Inverse Design and Experimental Verification of High-entropy Solder
LIU, Y. (Principal Investigator / Project Coordinator), GUO, Y. (Co-Investigator), LIU, S. (Co-Investigator) & TU, K. N. (Co-Investigator)
1/01/24 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), LIU, Y. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), FENG, S. P. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
Prizes
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Bronze Medal at the 49th International Exhibition of Inventions of Geneva
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2024
Prize: 64B_Prizes and awards
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2024 IEEE EPS Outstanding Young Engineer Award
LIU, Y. (Recipient), Apr 2024
Prize: 64B_Prizes and awards
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Silver Medal at 2023 International Exhibition of Inventions Geneva (IEIG)
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2023
Prize: 64B_Prizes and awards
Press/Media
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CityU’s record-breaking showing at International Exhibition of Inventions Geneva
LAU, C., LEUNG, M. Y. K., HILL, F. I., PANG, S. W., LI, H., WANG, S., YU, X., LEI, D., LI, Y., WU, W., ZHU, Z., TSO, C. Y., ZHANG, W., TU, K. N., LIU, Y., NG, S. T. T., ZHAO, S., LEE, W. M., LAM, H. F., LUO, X., ZHANG, Z., ZHAO, X., YAN, H., XIE, M., ZHU, K., JING, X., HU, J., TSE, C. F. N., LU, J., LAM, H. W. M., LAM, H. W. R., HO, J. C. Y., DAOUD, W., KHOO, B. L., KWONG, T. W. S., LI, X., CHAN, C. H., LUK, K. M., CHU, P. K. H., LO, P. K. P. & ZHI, C.
29/04/23
7 items of Media coverage
Press/Media: Press / Media
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CityUHK triumphs at the International Exhibition of Inventions of Geneva with 36 awards
PANG, S. W., TSE, C. K., FENG, S. P., CHAN, C. H., WU, G., KUO, W., JIANG, C., ZHU, Z., CHUNG, S. H. H., HU, J., CHEN, M. K., TSAI, D.-P., LIN, S. K. C., CHAN, L. L., LU, J., LY, T. H., LI, L., LAU, C., LI, X., HILL, F. I., WANG, C., KO, C. C. V., LEUNG, M. Y. K., YU, K. N. P., LAU, T. C., HO, J. C. Y., SONG, L., WANG, S., TU, K. N., LIU, Y., LU, Z., ZUKERMAN, M., WANG, Y., SUN, Y., YAN, H., LAU, C. K. T. & BAN, K.
20/04/24
8 items of Media coverage
Press/Media: Press / Media
Activities
- 1 61_Journal editor
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Frontiers in Materials (Journal)
LIU, Y. (Review Editor)
Jul 2022 → …Activity: Publication peer-review and editorial work (RGC: 61) › 61_Journal editor
Supervised Students
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Miss Peixuan LI, 李沛萱
- Department of Systems Engineering - Research Assistant
Person: Doctor of Philosophy (Student), Research Assistant
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