Dr. LIU Yingxia (劉影夏)

Patents (CityU)

  1. 2022
  2. Accepted/In press/Filed

    STABLE, OXIDATION-FREE, AND ROUGH COPPER SURFACE WITH THE FAST ANTI-PATHOGEN ABILITY

    LIU, Y. & TU, K. N., 2 Dec 2022, (Accepted/In press/Filed) Priority No. 63/429,790

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  3. Accepted/In press/Filed

    NANOTWIN COATED COPPER FOAM MATERIALS FOR VIRUS-CATCHING AND FAST-KILLING

    QU, J., LIU, Y. & TU, K. N., 23 Nov 2022, (Accepted/In press/Filed) Priority No. 63/427,588

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  4. Accepted/In press/Filed

    Anti-pathogen fiber coated with single crystal copper nanosheet

    LIU, Y. & TU, K. N., 13 Jul 2022, (Accepted/In press/Filed) Priority No. 63/388,988

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  5. Accepted/In press/Filed

    Room-temperature solid-state solder bonding technique

    LIU, Y. & TU, K. N., 11 Jul 2022, (Accepted/In press/Filed) Priority No. 63/388,125

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  6. Accepted/In press/Filed

    NANOSCALE GOLD-TO-GOLD DIRECT BONDING TECHNIQUE FOR MONOLITHIC 3D INTEGRATED CIRCUIT

    LIU, Y. & TU, K. N., 6 Jun 2022, (Accepted/In press/Filed) Priority No. 63/349,563

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  7. Accepted/In press/Filed

    3D Porous Structure Formed by Stacking or Rolling of Cu Cloths

    LIU, Y. & TU, K. N., 4 Apr 2022, (Accepted/In press/Filed) Priority No. 63/327,340

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  8. Accepted/In press/Filed

    THROUGH COPPER-OXIDE VIAS” FOR 2.5D IC AND 3D IC ADVANCED PACKAGING TECHNOLOGY

    LIU, Y. & TU, K. N., 4 Apr 2022, (Accepted/In press/Filed) Priority No. 63/327,343

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib