Dr. LIU Yingxia (劉影夏)

Research Output

  1. 2022
  2. Accepted/In press/Filed

    STABLE, OXIDATION-FREE, AND ROUGH COPPER SURFACE WITH THE FAST ANTI-PATHOGEN ABILITY

    LIU, Y. & TU, K. N., 2 Dec 2022, (Accepted/In press/Filed) Priority No. 63/429,790

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  3. Accepted/In press/Filed

    NANOTWIN COATED COPPER FOAM MATERIALS FOR VIRUS-CATCHING AND FAST-KILLING

    QU, J., LIU, Y. & TU, K. N., 23 Nov 2022, (Accepted/In press/Filed) Priority No. 63/427,588

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  4. Published

    Fast prediction of electromigration lifetime with modified mean-time-to-failure equation

    Liu, Y., Gusak, A., Jing, S. & Tu, K. N., 15 Oct 2022, In: Materials Letters. 325, 132880.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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  5. Accepted/In press/Filed

    Anti-pathogen fiber coated with single crystal copper nanosheet

    LIU, Y. & TU, K. N., 13 Jul 2022, (Accepted/In press/Filed) Priority No. 63/388,988

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  6. Accepted/In press/Filed

    Room-temperature solid-state solder bonding technique

    LIU, Y. & TU, K. N., 11 Jul 2022, (Accepted/In press/Filed) Priority No. 63/388,125

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  7. Accepted/In press/Filed

    NANOSCALE GOLD-TO-GOLD DIRECT BONDING TECHNIQUE FOR MONOLITHIC 3D INTEGRATED CIRCUIT

    LIU, Y. & TU, K. N., 6 Jun 2022, (Accepted/In press/Filed) Priority No. 63/349,563

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  8. Published

    A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

    Sun, L., Guo, Z., Zhao, X., Liu, Y., Tu, K. & Liu, Y., Jun 2022, In: Micromachines. 13, 6, 13 p., 867.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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  9. Accepted/In press/Filed

    3D Porous Structure Formed by Stacking or Rolling of Cu Cloths

    LIU, Y. & TU, K. N., 4 Apr 2022, (Accepted/In press/Filed) Priority No. 63/327,340

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  10. Accepted/In press/Filed

    THROUGH COPPER-OXIDE VIAS” FOR 2.5D IC AND 3D IC ADVANCED PACKAGING TECHNOLOGY

    LIU, Y. & TU, K. N., 4 Apr 2022, (Accepted/In press/Filed) Priority No. 63/327,343

    Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)

    Check@CityULib
  11. 2021
  12. 210°C reflow technology study in 3D Packaging

    Sun, L., Dong, Y., Hou, Z., Zhao, X., Huo, Y., Liu, Y. & Liu, Y., Sep 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT). Institute of Electrical and Electronics Engineers Inc., 4 p. (International Conference on Electronic Packaging Technology, ICEPT).

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Check@CityULib
  13. Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy

    Wei, Y., Liu, Y., Zhang, L. & Zhao, X., May 2021, In: Materials Characterization. 175, 111089.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
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  14. Surface diffusion controlled reaction in small size microbumps

    Liu, Y., Shi, X., Ren, H., Cai, J., Zhao, X., Tan, C. & Tu, K. N., 1 Feb 2021, In: Materials Letters. 284, Part 1, 129036.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
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  15. Cu 和 Sb 元素添加对 Sn-Bi 共晶合金性能的影响

    杨添淇, 赵修臣, 程荆卫, 谭成文, 于晓东 & 刘影夏, Feb 2021, In: Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering. 50, 2, p. 621-626

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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  16. Atomic insights of Cu nanoparticles melting and sintering behavior in Cu–Cu direct bonding

    Wu, R., Zhao, X. & Liu, Y., 1 Jan 2021, In: Materials and Design. 197, 109240.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 16
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  17. A Process Improvement in Silver-indium Transient Liquid Phase Bonding Method for the High-Power Electronics and Photonics Packaging

    Zhang, D., Zhao, X., Liu, Y., Liu, Y. & Huo, Y., 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 4 p. (International Conference on Electronic Packaging Technology, ICEPT).

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 1
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  18. Interconnect Quality and Reliability of 3D Packaging

    Wang, Y., Liu, Y., Li, M., Tu, K. N. & Xu, L., 2021, 3D Microelectronic Packaging: From Architectures to Applications. Li, Y. & Goyal, D. (eds.). 2nd ed. Singapore: Springer, p. 527-573 (Springer Series in Advanced Microelectronics; vol. 64).

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)12_Chapter in an edited book (Author)peer-review

    Scopus citations: 1
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  19. Published

    Undercooling and microstructure analysis for the design of low melting point solder

    Pu, L., Huo, Y., Zhao, X., Tu, K. N. & Liu, Y., 2021, 2021 5th IEEE Electron Devices Technology and Manufacturing Conference (EDTM). IEEE, 9420953. (IEEE Electron Devices Technology and Manufacturing Conference, EDTM).

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Check@CityULib
  20. 2020
  21. Low melting point solders based on Sn, Bi, and In elements

    Liu, Y. & Tu, K. N., Dec 2020, In: Materials Today Advances. 8, 100115.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 34
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  22. Published

    A high-entropy alloy as very low melting point solder for advanced electronic packaging

    Liu, Y., Pu, L., Yang, Y., He, Q., Zhou, Z., Tan, C., Zhao, X. & 2 others, Zhang, Q. & Tu, K. N., Sep 2020, In: Materials Today Advances. 7, 100101.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 11
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  23. The effect of Ag on the growth of intermetallics at the interface of Sn5Zn/Cu interconnects

    Guo, J., Zhao, X., Liu, Y., Tan, C., Liu, L., Ning, X., Nie, Z. & 1 others, Yu, X., Sep 2020, In: Materials Today Communications. 24, 100960.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 2
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