Dr. LIU Yingxia (劉影夏)

BS (Peking University), PhD (UCLA)

Visiting address
YEUNG-P6624
Phone: +852 34424728

Author IDs

Biography

Dr. Liu’s primary research interest is in reliability studies of advanced packaging technologies, such as Fan Out Packaging, and 2.5D/3D IC Packaging. Her recent research also extends to the development of interconnect and packaging technology for flexible electronics.

Qualifications/Experiences

2012 BS in Chemistry, Peking University, China
2016 PhD in Material Science and Engineering, UCLA, USA.
Her PhD thesis is about the reliability studies on the scaling effect of solder joints in 3D IC.

Research Interests/Areas

  • 3D IC packaging
  • Electromigration
  • Electrochemical migration
  • Low-temperature assembly