Prof. CHAN Yan Cheong (陳忍昌)

Student Theses

  1. 2018
  2. 2017
  3. 2016
  4. Design of Wideband Low Noise Amplifier and Mixer Using CMOS Technology

    Author: QIN, P., 24 Oct 2016

    Supervisor: XUE, Q. (Supervisor) & CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  5. 2015
  6. Study of nanomaterial reinforced under bump metallization (UBM) and lead-free solder matrix for advanced electronic packaging

    Author: HU, X., 2 Oct 2015

    Supervisor: LEE, C. S. (Supervisor) & CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  7. Development of nanoenergetic arrays based on core/shell nanothermites

    Author: XU, D., 15 Jul 2015

    Supervisor: ZHANG, K. (Supervisor) & CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  8. Metal/carbon nanotube composite materials and their application in advanced electronic packaging

    Author: XU, S., 16 Feb 2015

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  9. 2014
  10. SRAM-based ternary content addressable memory

    Author: ULLAH, Z., 3 Oct 2014

    Supervisor: CHEUNG, C. C. R. (Supervisor) & CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  11. Microstructure evolution and failure modes of interconnection with sub-micron solder layers

    Author: LI, Q., 15 Jul 2014

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  12. 2012
  13. Study of nanoparticle doped lead-free solder alloys for electronic packaging applications

    Author: ISMATHULLAKHAN, S., 16 Jul 2012

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  14. 2011
  15. Polymer/carbon nanotube composite materials and their electronic applications

    Author: TANG, Q., 3 Oct 2011

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  16. A study of micro and nano-particle doped lead-free composite solders for advanced electronic packaging

    Author: GAIN, A. K., 15 Jul 2011

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  17. 2010
  18. Development and application of a new product screening model for the electronic component distribution industry in China

    Author: CHUI, C. L., 15 Jul 2010

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  19. Electromigration and thermomigration studies of lead-free solder joints

    Author: GU, X., 17 Feb 2010

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  20. Studies the effect of degradation in indium tin oxide thin film on the liquid crystal display module performance

    Author: LEUNG, W. S., 17 Feb 2010

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Master's Thesis

  21. 2009
  22. Study on reliability of flip chip solder interconnects for high current density packaging

    Author: YANG, D., 16 Feb 2009

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  23. 2008
  24. Reliability studies of flip-chip and ball-grid-array solder joints under current stressing

    Author: WU, B., 15 Feb 2008

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Doctoral Thesis

  25. 2007
  26. Process modification and reliability study of nonconductive adhesive flip chip assembly for smart card application

    Author: MA, Y., 16 Jul 2007

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Master's Thesis

  27. A study on reliability of anisotropic conductive joints under thermally induced warpage for advanced packaging

    Author: LIYAKATHALI KHAN, L. A., 15 Feb 2007

    Supervisor: CHAN, Y. C. (Supervisor)

    Student thesis: Master's Thesis

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