Prof. CHAN Yan Cheong (陳忍昌)

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Research Output

  1. 2021
  2. Published

    Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition

    Jin, Z., Shen, Y., Huo, F., Chan, Y. C. & Nishikawa, H., Jun 2021, In: Journal of Materials Science. 56, 16, p. 9769–9779

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 3
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  3. Published

    Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods

    Jin, Z., Shen, Y., Zuo, Y., Chan, Y. C., Mannan, S. H. & Nishikawa, H., 2021, In: Scientific Reports. 11, 8668.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

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  4. 2019
  5. Published

    Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

    Jin, Z., Shen, Y., He, S., Zhou, S., Chan, Y. C. & Nishikawa, H., 14 Nov 2019, In: Journal of Applied Physics. 126, 18, 185109.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 12
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  6. Published

    Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

    Zhu, Z., Chan, Y. & Wu, F., Jan 2019, In: Microelectronics Reliability. 92, p. 12-19

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 12
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  7. 2018
  8. Published

    Failure analysis on Mobile Phone Batteries and Accessories

    JIN, Z., NISHIKAWA, H. & CHAN, Y. C., Dec 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). IEEE, p. 708-712 8654349. (Electronics Packaging Technology Conference Proceedings).

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

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  9. Published

    Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing

    Zhu, Z., Chan, Y. & Wu, F., Dec 2018, In: Microelectronics Reliability. 91, p. 179-182

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
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  10. Published

    Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction

    ZHOU, Z., MO, L., LIU, H., CHAN, Y. C. & WU, F., Dec 2018, In: Journal of Electronic Materials. 47, 12, p. 7435-7448

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 1
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  11. Published

    Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder

    Zhu, Z., Chan, Y., Chen, Z., Gan, C. & Wu, F., 6 Jun 2018, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 727, p. 160-169

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 45
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  12. Published

    Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs

    Sun, H., Chan, Y. C. & Wu, F., May 2018, In: Journal of Materials Science: Materials in Electronics. 29, 10, p. 8584-8593

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 9
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  13. Published

    Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

    Chen, G., Liu, L., Silberschmidt, V. V., Liu, C., Wu, F. & Chan, Y. C., Apr 2018, In: Journal of Materials Science: Materials in Electronics. 29, 7, p. 5253-5263

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 16
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  14. 2017
  15. Published

    Environmental impact analysis of smartwatch using SimaPro8 tools and energy dispersive X-ray spectroscopy (EDX) technique

    Ma, M. M. M., Zhu, Z. & Chan, Y. C., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE, p. 1-6

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 4
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  16. Published

    Reliability of wearable electronics-Case of water proof tests on smartwatch

    Yip, Y. Z., Zhu, Z. & Chan, Y., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 5
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  17. Published

    Review on test vehicles for electromigration (EM) study in solder interconnects

    Zhu, Z., Chan, Y., Wu, F., Gan, C. L. & Chen, Z., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 1
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  18. Published

    Reliability analysis of smartwatch

    Yip, Y. N. Z., Zhu, Z. & Chan, Y. C., Aug 2017, Proceedings - 2017 18th International Conference on Electronic Packaging Technology (ICEPT). Ye, T., Tian, Y. & Wang, C. (eds.). IEEE, p. 1011-1015

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 4
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  19. Published

    Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

    Zhu, Z., LI, Y., Chan, Y. C. & Wu, F., Jun 2017, In: Journal of Materials Science: Materials in Electronics. 28, 12, p. 8717-8724

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 4
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  20. Published

    Effect of Nickel-Coating Modified CNTs on the Dopant Dispersion and Performance of BGA Solder Joints

    Sun, H., Chan, Y. C., Hu, X. & Wu, F., May 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference. IEEE, p. 1981-1986

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 2
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  21. 2016
  22. Published

    Enhanced electromigration (EM) reliability of Sn58Bi solder due to the incorporation of ZrO2 nanoparticles

    Zhu, Z., Li, Y., Wu, F. & Chan, Y., 1 Dec 2016, 2016 6th Electronic System-Integration Technology Conference, ESTC 2016. Institute of Electrical and Electronics Engineers Inc., 7764722

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Check@CityULib
  23. Published

    Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

    Chen, G., Peng, H., Silberschmidt, V. V., Chan, Y. C., Liu, C. & Wu, F., 15 Nov 2016, In: Journal of Alloys and Compounds. 685, p. 680-689

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 52
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  24. Published

    Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

    Chen, G., Liu, L., Du, J., Silberschmidt, V. V., Chan, Y. C., Liu, C. & Wu, F., 1 Nov 2016, In: Journal of Materials Science. 51, 22, p. 10077-10091

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 22
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  25. Published

    Failure mechanisms of solder interconnects under current stressing - a progress update from recent studies on novel interconnect materials

    Chan, Y. C., Li, Y., Wu, F. & Chen, Z., Nov 2016, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., p. 417-426 7861514

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 1
    Check@CityULib
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