Prof. CHAN Yan Cheong (陳忍昌)
Research Output
- 2008
- Published
Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing
Wu, B. Y., Alam, M. O., Chan, Y. C. & Zhong, H. W., Apr 2008, In: Journal of Electronic Materials. 37, 4, p. 469-476Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 15 - Published
Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application
Tan, C. W., Chan, Y. C., Leung, B. & Liu, H. D., Jan 2008, In: Optics and Lasers in Engineering. 46, 1, p. 75-82Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 18 - Published
Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology
Rizvi, M. J., Lu, H., Bailey, C., Chan, Y. C., Lee, M. Y. & Pang, C. H., Jan 2008, In: Microelectronic Engineering. 85, 1, p. 238-244Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 19 - Published
A hybrid prognostics methodology for electronic products
Kumar, S., Torres, M., Chan, Y. C. & Pecht, M., 2008, Proceedings of the International Joint Conference on Neural Networks. p. 3479-3485 4634294Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review
Scopus citations: 38 - Published
Assessment of toxicity potential of metallic elements in discarded electronics: A case study of mobile phones in China
Wu, B. Y., Chan, Y. C., Middendorf, A., Gu, X. & Zhong, H. W., 2008, In: Journal of Environmental Sciences. 20, 11, p. 1403-1408Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 71 - Published
Corrosion reliability study of indium tin oxide (ITO) for chip-on-glass (COG)
Leung, W., Chan, Y. & Lui, S., 2008, Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008. 4958130Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review
- Published
Effect of 0.5 wt% Cu in Sn-3.5%Ag solder to retard interfacial reactions with the electroless Ni-P metallization for BGA solder joints application
Alam, M. O. & Chan, Y. C., 2008, In: IEEE Transactions on Components and Packaging Technologies. 31, 2 SPEC. ISS., p. 431-438Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 7 - Published
Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages
Gain, A. K., Chan, Y. C., Yung, K. C., Sharif, A. & Ali, L., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1291-1294 4684540Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review
Scopus citations: 4 - Published
Fracture mechanics analysis of cracks in solder joint intermetallic compounds
Alam, M. O., Lu, H., Bailey, C. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 757-762 4684445Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review
Scopus citations: 10 - Published
Impact of RoHS/WEEE- on effective recycling- electronics system integration
Ali, L. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 521-524 4684403Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review
Scopus citations: 6 - Published
Microstructural evolution by electromigration in line-type Cu/SnBi/Cu solder joint
Gu, X. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 885-890 4684469Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review
- Published
Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes
Ying, K. T., Stoyanov, S., Bailey, C. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 941-946 4684478Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review
- 2007
- Published
Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization
Sharif, A. & Chan, Y. C., 16 Aug 2007, In: Journal of Alloys and Compounds. 440, 1-2, p. 117-121Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 25 - Published
Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints
Yang, D., Wu, B. Y., Chan, Y. C. & Tu, K. N., 15 Aug 2007, In: Journal of Applied Physics. 102, 4, 43502.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 45 - Published
Effect of current stressing on the reliability of 63Sn37Pb solder joints
Wu, B. Y., Chan, Y. C., Zhong, H. W. & Alam, M. O., Aug 2007, In: Journal of Materials Science. 42, 17, p. 7415-7422Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 10 - Published
The effect of bonding force on the electrical performance and reliability of NCA joints processed at a lowered temperature
Ma, Y. & Chan, Y. C., Aug 2007, In: Journal of Materials Science. 42, 16, p. 6658-6664Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 3 - Published
Effect of adding 0.3 wt% Ni into the Sn-0.7 wt%Cu solder. Part I: Wetting behavior on Cu and Ni substrates
Rizvi, M. J., Bailey, C., Chan, Y. C. & Lu, H., 12 Jul 2007, In: Journal of Alloys and Compounds. 438, 1-2, p. 116-121Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 31 - Published
Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging
Rizvi, M. J., Bailey, C., Chan, Y. C., Islam, M. N. & Lu, H., 12 Jul 2007, In: Journal of Alloys and Compounds. 438, 1-2, p. 122-128Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 57 - Published
Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization
Zhong, W. H., Chan, Y. C., Wu, B. Y., Alam, M. O. & Guan, J. F., Jul 2007, In: Journal of Materials Science. 42, 13, p. 5239-5247Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 16 - Published
Retardation of spalling by the addition of Ag in Sn-Zn-Bi solder with the Au/Ni metallization
Sharif, A. & Chan, Y. C., 15 Feb 2007, In: Materials Science and Engineering A. 445-446, p. 686-690Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 19
