Prof. CHAN Yan Cheong (陳忍昌)

Research Output

  1. 2008
  2. Published

    Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing

    Wu, B. Y., Alam, M. O., Chan, Y. C. & Zhong, H. W., Apr 2008, In: Journal of Electronic Materials. 37, 4, p. 469-476

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 15
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  3. Published

    Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application

    Tan, C. W., Chan, Y. C., Leung, B. & Liu, H. D., Jan 2008, In: Optics and Lasers in Engineering. 46, 1, p. 75-82

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 18
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  4. Published

    Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology

    Rizvi, M. J., Lu, H., Bailey, C., Chan, Y. C., Lee, M. Y. & Pang, C. H., Jan 2008, In: Microelectronic Engineering. 85, 1, p. 238-244

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 19
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  5. Published

    A hybrid prognostics methodology for electronic products

    Kumar, S., Torres, M., Chan, Y. C. & Pecht, M., 2008, Proceedings of the International Joint Conference on Neural Networks. p. 3479-3485 4634294

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 38
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  6. Published

    Assessment of toxicity potential of metallic elements in discarded electronics: A case study of mobile phones in China

    Wu, B. Y., Chan, Y. C., Middendorf, A., Gu, X. & Zhong, H. W., 2008, In: Journal of Environmental Sciences. 20, 11, p. 1403-1408

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 71
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  7. Published

    Corrosion reliability study of indium tin oxide (ITO) for chip-on-glass (COG)

    Leung, W., Chan, Y. & Lui, S., 2008, Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008. 4958130

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  8. Published

    Effect of 0.5 wt% Cu in Sn-3.5%Ag solder to retard interfacial reactions with the electroless Ni-P metallization for BGA solder joints application

    Alam, M. O. & Chan, Y. C., 2008, In: IEEE Transactions on Components and Packaging Technologies. 31, 2 SPEC. ISS., p. 431-438

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 7
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  9. Published

    Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

    Gain, A. K., Chan, Y. C., Yung, K. C., Sharif, A. & Ali, L., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1291-1294 4684540

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 4
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  10. Published

    Fracture mechanics analysis of cracks in solder joint intermetallic compounds

    Alam, M. O., Lu, H., Bailey, C. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 757-762 4684445

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 10
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  11. Published

    Impact of RoHS/WEEE- on effective recycling- electronics system integration

    Ali, L. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 521-524 4684403

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 6
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  12. Published

    Microstructural evolution by electromigration in line-type Cu/SnBi/Cu solder joint

    Gu, X. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 885-890 4684469

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  13. Published

    Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes

    Ying, K. T., Stoyanov, S., Bailey, C. & Chan, Y. C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 941-946 4684478

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  14. 2007
  15. Published

    Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization

    Sharif, A. & Chan, Y. C., 16 Aug 2007, In: Journal of Alloys and Compounds. 440, 1-2, p. 117-121

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 25
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  16. Published

    Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

    Yang, D., Wu, B. Y., Chan, Y. C. & Tu, K. N., 15 Aug 2007, In: Journal of Applied Physics. 102, 4, 43502.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 45
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  17. Published

    Effect of current stressing on the reliability of 63Sn37Pb solder joints

    Wu, B. Y., Chan, Y. C., Zhong, H. W. & Alam, M. O., Aug 2007, In: Journal of Materials Science. 42, 17, p. 7415-7422

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 10
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  18. Published

    The effect of bonding force on the electrical performance and reliability of NCA joints processed at a lowered temperature

    Ma, Y. & Chan, Y. C., Aug 2007, In: Journal of Materials Science. 42, 16, p. 6658-6664

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
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  19. Published

    Effect of adding 0.3 wt% Ni into the Sn-0.7 wt%Cu solder. Part I: Wetting behavior on Cu and Ni substrates

    Rizvi, M. J., Bailey, C., Chan, Y. C. & Lu, H., 12 Jul 2007, In: Journal of Alloys and Compounds. 438, 1-2, p. 116-121

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 31
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  20. Published

    Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging

    Rizvi, M. J., Bailey, C., Chan, Y. C., Islam, M. N. & Lu, H., 12 Jul 2007, In: Journal of Alloys and Compounds. 438, 1-2, p. 122-128

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 57
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  21. Published

    Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

    Zhong, W. H., Chan, Y. C., Wu, B. Y., Alam, M. O. & Guan, J. F., Jul 2007, In: Journal of Materials Science. 42, 13, p. 5239-5247

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 16
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  22. Published

    Retardation of spalling by the addition of Ag in Sn-Zn-Bi solder with the Au/Ni metallization

    Sharif, A. & Chan, Y. C., 15 Feb 2007, In: Materials Science and Engineering A. 445-446, p. 686-690

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 19
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