Prof. CHAN Yan Cheong (陳忍昌)

Research Output

  1. 2009
  2. Published

    Effects of ZrO2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au/Ni/Cu pads

    Shen, J. & Chan, Y. C., 27 May 2009, In: Journal of Alloys and Compounds. 477, 1-2, p. 552-559

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 66
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  3. Published

    Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

    Gain, A. K., Chan, Y. C. & Yung, W. K. C., 25 May 2009, In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 162, 2, p. 92-98

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 60
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  4. Published

    The determination of hexavalent chromium (Cr6+) in electronic and electrical components and products to comply with RoHS regulations

    Hua, L., Chan, Y. C., Wu, Y. P. & Wu, B. Y., 3 Apr 2009, In: Journal of Hazardous Materials. 163, 2-3, p. 1360-1368

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 45
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  5. Published

    Fracture mechanics analysis of solder joint intermetallic compounds in shear test

    Alam, M. O., Lu, H., Bailey, C. & Chan, Y. C., Apr 2009, In: Computational Materials Science. 45, 2, p. 576-583

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 34
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  6. Published

    Research advances in nano-composite solders

    Shen, J. & Chan, Y. C., Mar 2009, In: Microelectronics Reliability. 49, 3, p. 223-234

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 198
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  7. Published

    The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes composite coating

    Gu, X., Chan, Y. C., Yang, D. & Wu, B. Y., 22 Jan 2009, In: Journal of Alloys and Compounds. 468, 1-2, p. 553-557

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 9
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  8. Published

    Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions

    Gaina, A. K., Chan, Y. C., Sharif, A. & Yung, W. K. C., 2009, Proceedings - Electronic Components and Technology Conference. p. 1021-1026 5074137

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 1
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  9. Published

    Finite-element simulation of stress intensity factors in solder joint intermetallic compounds

    Alam, M. O., Lu, H., Bailey, C. & Chan, Y. C., 2009, In: IEEE Transactions on Device and Materials Reliability. 9, 1, p. 40-48 4796374.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 10
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  10. Published

    Investigation of polyimide/carbon nanotube nanocomposites for high temperature electronic packaging applications

    Tang, Q. Y., Chan, Y. C. & Wong, N. B., 2009, Proceedings - 2009 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2009. p. 110-115

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 3
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  11. Published

    Thermomigration and electromigration in Sn58Bi solder joints

    Gu, X. & Chan, Y. C., 2009, In: Journal of Applied Physics. 105, 9, 93537.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 47
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  12. 2008
  13. Published

    Anisotropic Conductive Adhesives for Flip-Chip Interconnects

    Wang, W., Chan, Y. C. & Pecht, M., 23 Dec 2008, Electrically Conductive Adhesives. Gomatam, R. & Mittal, K. (eds.). CRC Press, p. 57-78

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)12_Chapter in an edited book (Author)peer-review

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  14. Published

    Electromigration in line-type Cu/Sn-Bi/Cu solder joints

    Gu, X. & Chan, Y. C., Nov 2008, In: Journal of Electronic Materials. 37, 11, p. 1721-1726

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 51
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  15. Published

    Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints

    Gu, X., Yang, D., Chan, Y. C. & Wu, B. Y., Oct 2008, In: Journal of Materials Research. 23, 10, p. 2591-2596

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 29
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  16. Published

    Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

    Yang, D., Chan, Y. C., Wu, B. Y. & Pecht, M., Sep 2008, In: Journal of Materials Research. 23, 9, p. 2333-2339

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 35
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  17. Published

    Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn-Ag solder during solidification

    Shen, J., Chan, Y. C. & Liu, S. Y., Sep 2008, In: Intermetallics. 16, 9, p. 1142-1148

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 51
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  18. Published

    The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing

    Yang, D., Chan, Y. C. & Tu, K. N., 28 Jul 2008, In: Applied Physics Letters. 93, 4, 41907.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 22
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  19. Published

    Electromigration of Pb-free solder under a low level of current density

    Zhang, J. S., Chan, Y. C., Wu, Y. P., Xi, H. J. & Wu, F. S., 30 Jun 2008, In: Journal of Alloys and Compounds. 458, 1-2, p. 492-499

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 37
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  20. Published

    Anisotropic conductive adhesives for flip-chip interconnects

    Wang, W., Chan, Y. C. & Pecht, M., 1 Jun 2008, In: Journal of Adhesion Science and Technology. 22, 8, p. 871-892

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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  21. Presented

    Mechanical behavior and low-cycle shear fatigue life of the pure Ni laser-welded joints in optoelectronics packaging

    Tan, C. W., Chan, Y. C., Leung, N. W. & Liu, H. D., May 2008, In: IEEE Transactions on Advanced Packaging. 31, 2, p. 386-393

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 4
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  22. Published

    Adhesive strength of flip chip packages

    Chiang, W. K., Chan, Y. C., Ralph, B. & Holland, A., Apr 2008, In: International Journal of Adhesion and Adhesives. 28, 3, p. 109-119

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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