Prof. CHAN Yan Cheong (陳忍昌)

Research Output

  1. 2010
  2. Published

    Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads

    Fouzder, T., Gain, A. K., Chan, Y. C., Sharif, A. & Yung, W. K. C., Dec 2010, In: Microelectronics Reliability. 50, 12, p. 2051-2058

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 34
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  3. Published

    Thermomigration and electromigration in Sn58Bi ball grid array solder joints

    Gu, X., Yung, K. C. & Chan, Y. C., Oct 2010, In: Journal of Materials Science: Materials in Electronics. 21, 10, p. 1090-1098

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 26
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  4. Published

    The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads

    Gain, A. K., Fouzder, T., Chan, Y. C., Sharif, A., Wong, N. B. & Yung, W. K. C., 10 Sep 2010, In: Journal of Alloys and Compounds. 506, 1, p. 216-223

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 82
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  5. Published

    Effect of carbon nanotubes and their dispersion on thermal curing of polyimide precursors

    Tang, Q., Chen, J., Chan, Y. C. & Chung, C. Y., Sep 2010, In: Polymer Degradation and Stability. 95, 9, p. 1672-1678

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 21
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  6. Published

    Surfactant-assisted processing of polyimide/multiwall carbon nanotube nanocomposites formicroelectronics applications

    Tang, Q., Chan, Y., Wong, N. & Cheungc, R., Sep 2010, In: Polymer International. 59, 9, p. 1240-1245

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 61
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  7. Published

    Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

    Ahmed, M., Fouzder, T., Sharif, A., Gain, A. K. & Chan, Y. C., Aug 2010, In: Microelectronics Reliability. 50, 8, p. 1134-1141

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 45
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  8. Published

    Study of the dispersion and electrical properties of carbon nanotubes treated by surfactants in dimethylacetamide

    Tang, Q. Y., Shafiq, I., Chan, Y. C., Wong, N. B. & Cheung, R., Aug 2010, In: Journal of Nanoscience and Nanotechnology. 10, 8, p. 4967-4974

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 30
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  9. Published

    Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

    Chan, Y. C. & Yang, D., Jul 2010, In: Progress in Materials Science. 55, 5, p. 428-475

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 239
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  10. Published

    Effect of additions of metallic (Ag, Ni) nano particles on the microstructure and shear strength of Sn-Zn solder in ball grid array packages

    GAIN, A. K., FOUZDER, T., CHAN, Y. C., SHARIF, A., WONG, N. B. & YUNG, K., 12 May 2010, p. 337-340.

    Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)peer-review

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  11. Published

    Electromigration Study of Nano Ag Doped Lead-Free Sn-58Bi on Cu and Au/Ni/Cu Ball Grid Array (BGA) packages

    ISMATHULLAKHAN, S., LI, Q., CHAN, Y. C., WONG, N. B. & YUNG, K., 12 May 2010.

    Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)peer-review

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  12. Published

    Influence of additions of ceramic (ZrO2, Al2O3) nano particles on the microstructure and shear strength of Sn-Ag-Cu solder

    GAIN, A. K., FOUZDER, T., CHAN, Y. C., SHARIF, A., WONG, N. & YUNG, K., 12 May 2010, p. 470-474.

    Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)peer-review

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  13. Published

    Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads

    Gain, A. K., Fouzder, T., Chan, Y. C., Sharif, A. & Yung, W. K. C., 21 Jan 2010, In: Journal of Alloys and Compounds. 489, 2, p. 678-684

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 27
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  14. Published

    An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies

    Dou, G., Whalley, D. C., Liu, C. & Chan, Y. C., 2010, In: Soldering and Surface Mount Technology. 22, 1, p. 47-55

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 11
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  15. Published

    Fast-response polyimide/multiwall carbon nanotube composite films for monitoring humidity in microelectronic packages

    Tang, Q. & Chan, Y. C., 2010, 2010 12th Electronics Packaging Technology Conference, EPTC 2010. p. 265-268 5702645

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 4
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  16. 2009
  17. Published

    Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages

    Gain, A. K., Chan, Y. C., Sharif, A. & Yung, W. K. C., Nov 2009, In: Microelectronic Engineering. 86, 11, p. 2347-2353

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 28
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  18. Published

    Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads

    Das, S. K., Sharif, A., Chan, Y. C., Wong, N. B. & Yung, W. K. C., Oct 2009, In: Microelectronic Engineering. 86, 10, p. 2086-2093

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 25
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  19. Published

    Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

    Shen, J., Chan, Y. C. & Liu, S. Y., Oct 2009, In: Acta Materialia. 57, 17, p. 5196-5206

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 108
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  20. Published

    Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy

    Das, S. K., Sharif, A., Chan, Y. C., Wong, N. B. & Yung, W. K. C., 29 Jul 2009, In: Journal of Alloys and Compounds. 481, 1-2, p. 167-172

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 55
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  21. Published

    Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages

    Gain, A. K., Chan, Y. C., Sharif, A., Wong, N. B. & Yung, W. K. C., Jul 2009, In: Microelectronics Reliability. 49, 7, p. 746-753

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 48
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  22. Published

    Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn-Ag-Cu solder and a Cu layer

    Shen, J. & Chan, Y. C., 27 May 2009, In: Journal of Alloys and Compounds. 477, 1-2, p. 909-914

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 52
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