Prof. CHAN Yan Cheong (陳忍昌)

?
Filters
Filters

Reset

to
81 - 100 out of 428Page size: 20

Research Output

  1. 2012
  2. Published

    Development of a versatile capacitive tactile sensor based on transparent flexible materials integrating an excellent sensitivity and a high resolution

    Zhang, H. Z., Tang, Q. Y. & Chan, Y. C., 2012, In: AIP Advances. 2, 2, 22112.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 13
    Check@CityULib
  3. Published

    FPGA implementation of SRAM-based ternary content addressable memory

    Ullah, Z., Jaiswal, M. K., Chan, Y. C. & Cheung, R. C. C., 2012, Proceedings of the 2012 IEEE 26th International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2012. p. 383-389 6270666

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 24
    Check@CityULib
  4. Published

    Influence of diamond additions on lead-free Sn-Zn-Bi Solder-alloys

    Qin, P., Hu, X. & Chan, Y. C., 2012, 2012 4th Electronic System-Integration Technology Conference, ESTC 2012. IEEE Computer Society, 6542091

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Check@CityULib
  5. Published

    Microstructure and plating thickness analysis of different surface finished plated printed circuit boards

    Fouzder, T., Chan, Y. C. & Chan, D. K., 2012, Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. p. 1-3 6507039

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Check@CityULib
  6. Published

    Reinforced performance of lead-free Sn-8Zn-3Bi Solder With Doping of 0.03 wt.% C60 on Cu Pads

    Hu, X., Qin, P. & Chan, Y. C., 2012, 2012 4th Electronic System-Integration Technology Conference, ESTC 2012. IEEE Computer Society, 6542075

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Check@CityULib
  7. Published

    Remedies to control electromigration: Effects of CNT doped Sn-Ag-Cu interconnects

    Xu, S., Zhu, X., Kotadia, H., Lu, H., Mannan, S. H., Bailey, C. & Chan, Y. C., 2012, Proceedings - Electronic Components and Technology Conference. p. 1899-1904 6249097

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 6
    Check@CityULib
  8. 2011
  9. Published

    Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

    Gain, A. K., Chan, Y. C. & Yung, W. K. C., Dec 2011, In: Microelectronics Reliability. 51, 12, p. 2306-2313

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 97
    Check@CityULib
  10. Published

    Efficient field emission and optical properties of In-doped cadmium sulphide nanopens and nanopencils

    Shafiq, I. & Chan, Y., Aug 2011, In: Micro and Nano Letters. 6, 8, p. 732-736

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 2
    Check@CityULib
  11. Published

    Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates

    Gain, A. K., Chan, Y. C. & Yung, W. K. C., May 2011, In: Microelectronics Reliability. 51, 5, p. 975-984

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 96
    Check@CityULib
  12. Published

    Computational study on the mechanical properties in nanoscale Cu/Sn/Cu Solder joints

    XU, S., CHAN, Y. C., LI, Q. & ISMATHULLAKHAN, S., 13 Apr 2011.

    Research output: Conference Papers (RGC: 31A, 31B, 32, 33) › 32_Refereed conference paper (no ISBN/ISSN) › peer-review

    Check@CityULib
  13. Published

    Thermomigration and electromigration in Sn8Zn3Bi solder joints

    Gu, X., Yung, K. C., Chan, Y. C. & Yang, D., Mar 2011, In: Journal of Materials Science: Materials in Electronics. 22, 3, p. 217-222

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 18
    Check@CityULib
  14. Published

    Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films

    Tang, Q., Chan, Y. C. & Zhang, K., 20 Feb 2011, In: Sensors and Actuators, B: Chemical. 152, 1, p. 99-106

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 107
    Check@CityULib
  15. Published

    Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads

    Gain, A. K., Fouzder, T., Chan, Y. C. & Yung, W. K. C., 17 Feb 2011, In: Journal of Alloys and Compounds. 509, 7, p. 3319-3325

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 83
    Check@CityULib
  16. Published

    Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

    Fouzder, T., Shafiq, I., Chan, Y. C., Sharif, A. & Yung, W. K. C., 3 Feb 2011, In: Journal of Alloys and Compounds. 509, 5, p. 1885-1892

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 69
    Check@CityULib
  17. Published

    Electromigration in flip-chip solder joints

    YANG, D., CHAN, Y. C. & PECHT, M., 2011, Electromigration in Thin Films and Electronic Devices: Materials and Reliability. Kim, C. (ed.). Cambridge: Woodhead Publishing, p. 285-329

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 12_Chapter in an edited book (Author) › peer-review

    Check@CityULib
  18. Published

    Electro-migration study of nano Al doped lead-free Sn-58Bi on Cu and Au/Ni/Cu ball grid array (BGA) packages

    Shafiq, I., Chan, Y. C., Xu, S. & Li, Q. Q., 2011, EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. 6142385

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 3
    Check@CityULib
  19. Published

    Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure

    Li, Q., Chan, Y. C. & Ismathullakhan, S., 2011, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. p. 289-293 6184433

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 4
    Check@CityULib
  20. Published

    Improved electro-migration resistance in nano Ag modified Sn-58Bi solder joints under current stressing

    Shafiq, I. & Chan, Y. C., 2011, ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering. p. 374-379 5976634

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 6
    Check@CityULib
  21. Published

    Multi-physics computer simulation of the electromigration phenomenon

    Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Chan, Y. C. & Bailey, C., 2011, ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. p. 448-452 6066874

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 3
    Check@CityULib
  22. Published

    Thermal analysis of high brightness flip-chip LED packages

    Qin, P., Li, Q. & Chan, Y. C., 2011, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. p. 722-725 6184513

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 4
    Check@CityULib
Previous 1 2 3 4 5 6 7 8 ...22 Next