Prof. CHAN Yan Cheong (陳忍昌)

Research Output

  1. 2014
  2. Published

    Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders

    Gain, A. K. & Chan, Y. C., May 2014, In: Microelectronics Reliability. 54, 5, p. 945-955

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 63
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  3. Published

    Effect of TiO2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection

    Hu, X., Xu, S., Yang, Y., Chen, Z. & Chan, Y. C., 10 Apr 2014, In: Materials Science and Engineering A. 600, p. 67-75

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 27
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  4. Published

    Reliability of washable wearable screen printed UHF RFID tags

    Virkki, J., Björninen, T., Kellomäki, T., Merilampi, S., Shafiq, I., Ukkonen, L., Sydänheimo, L., & 1 othersChan, Y. C., Apr 2014, In: Microelectronics Reliability. 54, 4, p. 840-846

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 29
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  5. Published

    Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating

    Li, Q., Chan, Y. C. & Chen, Z., Mar 2014, In: Journal of Materials Science: Materials in Electronics. 25, 3, p. 1222-1227

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
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  6. Published

    Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates

    Fouzder, T., Chan, Y. C. & Chan, D. K., 30 Jan 2014, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 69-74 7028281

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  7. Published

    Effect of 1 wt% ZnO nanoparticles addition on the microstructure, IMC development, and mechanical properties of high Bi content Sn-57.6Bi-0.4Ag solder on Ni metalized Cu pads

    Wu, N., Ismathullakhan, S. & Chan, Y. C., 2014, In: Journal of Materials Science: Materials in Electronics. 25, 5, p. 2169-2176

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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  8. Published

    Fabrication and characterizations of frequency-tunable soft composite antennas for wireless sensing

    Tangf, Q., Sun, H., Pan, Y., Chan, Y. C. & Leung, K. W., 2014, 8th European Conference on Antennas and Propagation, EuCAP 2014. Institute of Electrical and Electronics Engineers Inc., p. 2978-2980 6902453

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  9. 2013
  10. Published

    Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis

    Hua, X., Chan, Y. C., Zhang, K. & Yung, K. C., 15 Dec 2013, In: Journal of Alloys and Compounds. 580, p. 162-171

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 77
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  11. Published

    Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0Ag-0.5Cu solder alloy

    Shafiq, I., Lau, H. Y. & Chan, Y. C., Sep 2013, In: Journal of Electronic Materials. 42, 9, p. 2835-2847

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 9
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  12. Published

    Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn-Cu binary and Cu-Sn-Cu sandwich structures

    Li, Q. & Chan, Y. C., 5 Aug 2013, In: Journal of Alloys and Compounds. 567, p. 47-53

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 47
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  13. Published

    Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn-58Bi solder joint

    Ismathullakhan, S., Lau, H. & Chan, Y., Jul 2013, In: Microsystem Technologies. 19, 7, p. 1069-1080

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 25
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  14. Published

    Study of Microstructure Evolution in Nanoscale-thickness in Cu-Sn/Zn-Cu Sandwich Structure For 3D Packaging

    LI, Q. & CHAN, Y. C., 10 Apr 2013.

    Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)peer-review

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  15. Published

    A study of degradation of indium tin oxide thin films on glass for display applications

    Leung, W. S., Chan, Y. C. & Lui, S. M., Jan 2013, In: Microelectronic Engineering. 101, p. 1-7

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 17
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  16. Published

    Comments on electromigration analysis methods

    Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. & Chan, Y. C., 2013, Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013. IEEE Computer Society, p. 529-534 6756527

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  17. Published

    Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications

    Yin, C. Y., Lu, H., Bailey, C. & Chan, Y. C., 2013, In: Microelectronic Engineering. 107, p. 17-22

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 11
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  18. Published

    Electromigration aware design for nano-packaging

    Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. & Chan, Y. C., 2013, Proceedings of the IEEE Conference on Nanotechnology. p. 24-29 6720970

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  19. 2012
  20. Published

    The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads

    Gain, A. K. & Chan, Y. C., Oct 2012, In: Intermetallics. 29, p. 48-55

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 53
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  21. Published

    Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

    Shafiq, I., Chan, Y. C., Wong, N. B. & Yung, W. K. C., Jul 2012, In: Journal of Materials Science: Materials in Electronics. 23, 7, p. 1427-1434

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 15
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  22. Published

    Frequency-tunable soft composite antennas for wireless sensing

    Tang, Q., Pan, Y., Chan, Y. C. & Leung, K. W., Jun 2012, In: Sensors and Actuators, A: Physical. 179, p. 137-145

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 27
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  23. Published

    Disapperance of Sn Layer and Microstructure Evolution of Intermetallic Compounds in Nano-scale Solder Thickness Cu-Sn-Cu Sandwich Structure

    LI, Q., QIN, P., Xu, S. & CHAN, Y. C., 17 Apr 2012, p. 156-161.

    Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)peer-review

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