Prof. CHAN Yan Cheong (陳忍昌)

Research Output

  1. 2015
  2. Published

    Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints

    Hu, T., Li, Y., Chan, Y. & Wu, F., Jul 2015, In: Microelectronics Reliability. 55, 8, p. 1226-1233 11538.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 40
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  3. Published

    Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints

    Sun, H., Chan, Y. C. & Wu, F., Jul 2015, In: Journal of Materials Science: Materials in Electronics. 26, 7, p. 5129-5134

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 12
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  4. Published

    The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints

    Sun, H., Chan, Y. C. & Wu, F., Jul 2015, In: Journal of Materials Science: Materials in Electronics. 26, 7, p. 5318-5325

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 9
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  5. Published

    Implementation and wireless readout of passive UHF RFID strain sensor tags based on electro-textile antennas

    Long, F., Zhang, X. D., Bjorninen, T., Virkki, J., Sydanheimo, L., Chan, Y. & Ukkonen, L., Apr 2015, 2015 9th European Conference on Antennas and Propagation, EuCAP 2015. Institute of Electrical and Electronics Engineers Inc., 7228285

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 40
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  6. Published

    Impact of antenna-fiber alignment and recurrent stretching on the performance of passive UHF RFID tags based on textile antennas

    Zhang, X. D., Yang, M. H., Virkki, J., Björninen, T., Merilampi, S., Sydänheimo, L., Chan, Y., & 1 othersUkkonen, L., 5 Feb 2015, Conference Proceedings - 2014 IEEE MTT-S International Microwave Workshop Series on: RF and Wireless Technologies for Biomedical and Healthcare Applications, IMWS-Bio 2014. Institute of Electrical and Electronics Engineers Inc., 7032384

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  7. Published

    Experimental study on the washing durability of electro-textile UHF RFID tags

    Fu, Y. Y., Chan, Y. L., Yang, M. H., Chan, Y., Virkki, J., Björninen, T., Sydänheimo, L., & 1 othersUkkonen, L., 2015, In: IEEE Antennas and Wireless Propagation Letters. 14, p. 466-469 6949620.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 44
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  8. 2014
  9. Published

    Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

    Fouzder, T., Chan, Y. C. & Chan, D. K., Dec 2014, In: Journal of Materials Science: Materials in Electronics. 25, 12, p. 5375-5387

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 24
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  10. Published

    Reinforced solder joint performance by incorporation of ZrO2 nanoparticles in electroless Ni-P composite layer

    Hu, X. & Chan, Y. C., 28 Nov 2014, In: Journal of Materials Research. 29, 22, p. 2657-2666

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 4
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  11. Published

    Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

    Sun, H. & Chan, Y. C., 18 Nov 2014, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962816

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 1
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  12. Published

    Effect of pad shape on electromigration in solder bump joints

    Li, Y., Chan, Y. C. & Zhao, X., 18 Nov 2014, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962849

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  13. Published

    Electroless Ni-P-ZrO2 metallization for lead-free solder interconnection

    Hu, X. & Chan, Y. C., 13 Oct 2014, Proceedings of the Electronic Packaging Technology Conference, EPTC. Institute of Electrical and Electronics Engineers Inc., p. 820-824 6922774

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 3
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  14. Published

    A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

    Sun, H., Li, Q. & Chan, Y. C., Oct 2014, In: Journal of Materials Science: Materials in Electronics. 25, 10, p. 4380-4390

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 41
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  15. Published

    On-chip multilayer inductor design in near-field wireless connection for 3D-system integration

    Zhang, X., Zou, X., Chan, Y. & Tong, Q., 16 Sep 2014, p. 1-5.

    Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)peer-review

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  16. Published

    Effective method to disperse and incorporate Carbon nanotubes in electroless Ni-P deposits

    Xu, S., Chan, Y. C., Zhu, X., Lu, H. & Bailey, C., 11 Sep 2014, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 1342-1347 6897466

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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  17. Published

    Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

    Fouzder, T., Li, Q., Chan, Y. C. & Chan, D. K., Sep 2014, In: Journal of Materials Science: Materials in Electronics. 25, 9, p. 4012-4023

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 14
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  18. Published

    Electromigration in Sn-Ag solder thin films under high current density

    Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. & Chan, Y. C., 28 Aug 2014, In: Thin Solid Films. 565, p. 193-201

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 18
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  19. Published

    Study of microstructure evolution in novel Sn-Zn/Cu bi-layer and Cu/Sn-Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection

    Li, Q., Chan, Y. C., Zhang, K. & Yung, K. C., 25 Jun 2014, In: Microelectronic Engineering. 122, p. 52-58

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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  20. Published

    Effect of carbon nanotubes and their dispersion on electroless Ni-P under bump metallization for lead-free solder interconnection

    Xu, S., Hu, X., Yang, Y., Chen, Z. & Chan, Y. C., Jun 2014, In: Journal of Materials Science: Materials in Electronics. 25, 6, p. 2686-2691

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 17
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  21. Published

    Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

    Fouzder, T., Li, Q., Chan, Y. C. & Chan, D. K., Jun 2014, In: Journal of Materials Science: Materials in Electronics. 25, 6, p. 2529-2539

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 11
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  22. Published

    Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

    Xu, S., Chan, Y. C., Zhang, K. & Yung, K. C., 15 May 2014, In: Journal of Alloys and Compounds. 595, p. 92-102

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 104
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