Prof. CHAN Yan Cheong (陳忍昌)

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Research Output

  1. 2016
  2. Published

    An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints

    Peng, H., Chen, G., Mo, L., Chan, Y. C., Wu, F. & Liu, H., 1 Sep 2016, In: Journal of Materials Science: Materials in Electronics. 27, 9, p. 9083-9093

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
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  3. Published

    Investigation in microstructure and mechanical properties of Ni-coated multi-wall carbon nanotubes doped Sn3.0Ag0.5Cu solder alloys

    Xiao, H., Chan, Y., Zhu, Z. & Wu, F., Sep 2016, Electronic System-Integration Technology Conference (ESTC), 2016 6th. IEEE, 7764686

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 1
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  4. Published

    Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/Ine–48Sn/Cu solder interconnects under current stressing

    Li, Y., Lim, A. B. Y., Luo, K., Chen, Z., Wu, F. & Chan, Y. C., 15 Jul 2016, In: Journal of Alloys and Compounds. 673, p. 372-382

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 28
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  5. Published

    Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Li, Y., Luo, K., Lim, A. B. Y., Chen, Z., Wu, F. & Chan, Y. C., 4 Jul 2016, In: Materials Science & Engineering A. 669, p. 291-303

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 29
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  6. Published

    Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

    Zhu, Z., Sun, H., Wu, F. & Chan, Y., Jul 2016, In: Journal of Materials Science: Materials in Electronics. 27, 7, p. 6835-6844

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
    Check@CityULib
  7. Published

    Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints

    Sun, H., Chan, Y. C. & Wu, F., 22 Feb 2016, In: Materials Science & Engineering A. 656, p. 249-255

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 26
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  8. Published

    Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

    Chen, G., Wu, F., Liu, C., Silberschmidt, V. V. & Chan, Y. C., 25 Jan 2016, In: Journal of Alloys and Compounds. 656, p. 500-509

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 100
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  9. Published

    A comparison study of electromigration in In-48Sn solder interconnects with Cu and Au/Ni/Cu pads

    Li, Y., Chan, Y. C. & Wu, F., 2016, 2016 International Conference on Electronics Packaging (ICEP). The Technical Program Committee (ed.). IEEE, p. 689-692

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 1
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  10. Published

    An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder

    Chen, G., Huang, B., Liu, H., Chan, Y. C., Tang, Z. & Wu, F., 2016, In: Soldering and Surface Mount Technology. 28, 2, p. 84-92

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 10
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  11. Published

    Effect of Zn addition on interfacial reactions between Sn-Bi solder and Cu substrate

    Mokhtari, O., Zhou, S., Chan, Y. C. & Nishikawa, H., 2016, In: Materials Transactions. 57, 8, p. 1272-1276

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
    Check@CityULib
  12. Published

    Retained ratio of reinforcement in SAC305 composite solder joints: Effect of reinforcement type, processing and reflow cycle

    Chen, G., Liu, L., Silberschmidt, V. V., Chan, Y. C., Liu, C. & Wu, F., 2016, In: Soldering and Surface Mount Technology. 28, 3, p. 159-166

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 10
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  13. 2015
  14. Published

    Electromigration study of SnCu0.7 solder joints with Ag added by different methods

    Zhu, Z., Sun, H., Chan, Y. & Wu, F., Dec 2015, Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 7412350

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 1
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  15. Published

    Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads

    Li, Y., Wu, F. & Chan, Y. C., Nov 2015, In: Journal of Materials Science: Materials in Electronics. 26, 11, p. 8522-8533

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 21
    Check@CityULib
  16. Published

    Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi-Ag composite solders

    Li, Y. & Chan, Y. C., 5 Oct 2015, In: Journal of Alloys and Compounds. 645, p. 566-576

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 79
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  17. Published

    Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

    Gain, A. K., Zhang, L. & Chan, Y. C., Sep 2015, In: Journal of Materials Science: Materials in Electronics. 26, 9, p. 7039-7048

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 38
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  18. Published

    Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint

    Peng, H., Huang, B., Chen, G., Wu, F., Liu, H. & Chan, Y. C., Aug 2015, Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT) . IEEE, p. 1014-1017 7236751

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 3
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  19. Published

    Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint

    Zhu, Z., Chan, Y. & Wu, F., Aug 2015, Proceedings of 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, p. 140-143 7236561

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 5
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  20. Published

    Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder

    Chen, G., Wu, F., Liu, C. & Chan, Y. C., 15 Jul 2015, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2015-July. p. 1262-1267 7159759

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 4
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  21. Published

    Novel WO3 nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection

    Hu, X. & Chan, Y. C., 15 Jul 2015, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2015-July. p. 1464-1469 7159790

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 2
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  22. Published

    Brush-painted silver UHF RFID tags on environmental-friendly and flexible substrates

    Ren, Y., Virkki, J., Sydanheimo, L., Ukkonen, L. & Chan, Y., Jul 2015, IEEE Antennas and Propagation Society, AP-S International Symposium (Digest). Institute of Electrical and Electronics Engineers Inc., Vol. 2015-October. p. 1314-1315 7305046

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45) › 32_Refereed conference paper (with ISBN/ISSN) › peer-review

    Scopus citations: 2
    Check@CityULib
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