Prof. CHAN Yan Cheong (陳忍昌)

Research Output

  1. 2021
  2. Published

    Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition

    Jin, Z., Shen, Y., Huo, F., Chan, Y. C. & Nishikawa, H., Jun 2021, In: Journal of Materials Science. 56, 16, p. 9769–9779

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 2
    Check@CityULib
  3. Published

    Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods

    Jin, Z., Shen, Y., Zuo, Y., Chan, Y. C., Mannan, S. H. & Nishikawa, H., 2021, In: Scientific Reports. 11, 8668.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Check@CityULib
  4. 2019
  5. Published

    Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

    Jin, Z., Shen, Y., He, S., Zhou, S., Chan, Y. C. & Nishikawa, H., 14 Nov 2019, In: Journal of Applied Physics. 126, 18, 185109.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 12
    Check@CityULib
  6. Published

    Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

    Zhu, Z., Chan, Y. & Wu, F., Jan 2019, In: Microelectronics Reliability. 92, p. 12-19

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 12
    Check@CityULib
  7. 2018
  8. Published

    Failure analysis on Mobile Phone Batteries and Accessories

    JIN, Z., NISHIKAWA, H. & CHAN, Y. C., Dec 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). IEEE, p. 708-712 8654349. (Electronics Packaging Technology Conference Proceedings).

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Check@CityULib
  9. Published

    Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing

    Zhu, Z., Chan, Y. & Wu, F., Dec 2018, In: Microelectronics Reliability. 91, p. 179-182

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 11
    Check@CityULib
  10. Published

    Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction

    ZHOU, Z., MO, L., LIU, H., CHAN, Y. C. & WU, F., Dec 2018, In: Journal of Electronic Materials. 47, 12, p. 7435-7448

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
    Check@CityULib
  11. Published

    Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder

    Zhu, Z., Chan, Y., Chen, Z., Gan, C. & Wu, F., 6 Jun 2018, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 727, p. 160-169

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 43
    Check@CityULib
  12. Published

    Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs

    Sun, H., Chan, Y. C. & Wu, F., May 2018, In: Journal of Materials Science: Materials in Electronics. 29, 10, p. 8584-8593

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
    Check@CityULib
  13. Published

    Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

    Chen, G., Liu, L., Silberschmidt, V. V., Liu, C., Wu, F. & Chan, Y. C., Apr 2018, In: Journal of Materials Science: Materials in Electronics. 29, 7, p. 5253-5263

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 15
    Check@CityULib
  14. 2017
  15. Published

    Environmental impact analysis of smartwatch using SimaPro8 tools and energy dispersive X-ray spectroscopy (EDX) technique

    Ma, M. M. M., Zhu, Z. & Chan, Y. C., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE, p. 1-6

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 4
    Check@CityULib
  16. Published

    Reliability of wearable electronics-Case of water proof tests on smartwatch

    Yip, Y. Z., Zhu, Z. & Chan, Y., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 5
    Check@CityULib
  17. Published

    Review on test vehicles for electromigration (EM) study in solder interconnects

    Zhu, Z., Chan, Y., Wu, F., Gan, C. L. & Chen, Z., Dec 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 1
    Check@CityULib
  18. Published

    Reliability analysis of smartwatch

    Yip, Y. N. Z., Zhu, Z. & Chan, Y. C., Aug 2017, Proceedings - 2017 18th International Conference on Electronic Packaging Technology (ICEPT). Ye, T., Tian, Y. & Wang, C. (eds.). IEEE, p. 1011-1015

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 4
    Check@CityULib
  19. Published

    Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

    Zhu, Z., LI, Y., Chan, Y. C. & Wu, F., Jun 2017, In: Journal of Materials Science: Materials in Electronics. 28, 12, p. 8717-8724

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 4
    Check@CityULib
  20. Published

    Effect of Nickel-Coating Modified CNTs on the Dopant Dispersion and Performance of BGA Solder Joints

    Sun, H., Chan, Y. C., Hu, X. & Wu, F., May 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference. IEEE, p. 1981-1986

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 2
    Check@CityULib
  21. 2016
  22. Published

    Enhanced electromigration (EM) reliability of Sn58Bi solder due to the incorporation of ZrO2 nanoparticles

    Zhu, Z., Li, Y., Wu, F. & Chan, Y., 1 Dec 2016, 2016 6th Electronic System-Integration Technology Conference, ESTC 2016. Institute of Electrical and Electronics Engineers Inc., 7764722

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Check@CityULib
  23. Published

    Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

    Chen, G., Peng, H., Silberschmidt, V. V., Chan, Y. C., Liu, C. & Wu, F., 15 Nov 2016, In: Journal of Alloys and Compounds. 685, p. 680-689

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 50
    Check@CityULib
  24. Published

    Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

    Chen, G., Liu, L., Du, J., Silberschmidt, V. V., Chan, Y. C., Liu, C. & Wu, F., 1 Nov 2016, In: Journal of Materials Science. 51, 22, p. 10077-10091

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 21
    Check@CityULib
  25. Published

    Failure mechanisms of solder interconnects under current stressing - a progress update from recent studies on novel interconnect materials

    Chan, Y. C., Li, Y., Wu, F. & Chen, Z., Nov 2016, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., p. 417-426 7861514

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

    Scopus citations: 1
    Check@CityULib
Previous 1 2 3 4 5 6 7 8 ...22 Next