PUN Po Leung (潘寶樑)

Research Output

  1. 2019
  2. Published

    Application of Fuzzy Integrated FMEA with Product Lifetime Consideration for New Product Development in Flexible Electronics Industry

    Pun, K. P. L., Rotanson, J., Cheung, C. & Chan, A. H. S., 1 Apr 2019, In : Journal of Industrial Engineering and Management. 12, 1, p. 176-200

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 1
    Check@CityULib
  3. 2018
  4. Published

    Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

    PUN, K. P. L., ISLAM, M. N., ROTANSON, J., CHEUNG, C. & CHAN, A. H. S., Sep 2018, In : Journal of Electronic Materials. 47, 9, p. 5191–5202

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 5
    Check@CityULib
  5. Published

    Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

    Pun, K. P. L., Ali, L., Kohtoku, M., Cheung, C., Chan, A. H. S. & Wong, C. P., Apr 2018, In : Journal of Materials Science: Materials in Electronics. 29, 8, p. 6937–6949

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 3
    Check@CityULib
  6. 2017
  7. Published

    Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds

    Pun, K. P. L., Dhaka, N. S., Cheung, C. & Chan, A. H. S., Nov 2017, In : Microelectronics Reliability. 78, p. 339-348

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 4
    Check@CityULib
  8. Published

    Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging

    Pun, K. P. L., Islam, M. N., Cheung, C. W. & Chan, A. H. S., Sep 2017, In : Journal of Materials Science: Materials in Electronics. 28, 17, p. 12617-12629

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 7
    Check@CityULib