PUN Po Leung (潘寶樑)
Dr. Kelvin Pun Po Leung is the CTO and Vice President of Business Development of Compass Technology Co. Ltd. Notably, he drives innovation strategy, directs technology development, and ensures technology excellence. He leads in defining the company’s long-term technology strategy and vision and advocating for that vision with customers.
He has over 20 years of professional experience in the field of electronic IC packaging. His experience encompasses product development, technical sales, and engineering management. Moreover, He owns extensive practical experiences in flexible substrate design, System in Package (SiP), and failure analysis. He also works with multinational companies to delivering technology-edge solutions in the fields of medical equipment, optoelectronic equipment, and consumer products.
Over the years, he won different awards including
- Gold medal at the 47th International Exhibition of Inventions of Geneva
- RD100, in recognition of his work as one of the top 100 most significant technologically new products in 2019.
- CES innovation award in 2019
- The best paper award on lead-free solder joint reliability in 2009 at the ICEPT international electronics packaging conference.
He has published more than 20 papers in peer-reviewed journals and international conferences. Accumulating 28 granted and pending US patents, he serves as a chair of the Technical Committee of the 2020 ICEPT International Electronic Packaging Technology Conference. He has also presented keynote speeches at numerous conferences and technical symposiums related to electronics IC packaging and materials.
-Advanced substrate technology, integrated battery, and electro-optical circuit board.
-Nano-functional and reliability of interconnect materials, including microstructure characterization, contributing to the reliability of interconnection in thermal, mechanical, and electric fields.
-High-density interconnection for IC packaging.