PUN Po Leung (潘寶樑)
Chief Technology Officer, Compass Technology Company Limited
Dr. Kelvin Pun Po Leung is currently CTO at Compass Technology Co. Ltd. He has over 20 years of experience in electronics IC packaging where he was mainly engaged in product development and reliability engineering. He has extensive hands on experience in flexible substrate design, assembly, and failure analysis. He has worked with world leading multi-national companies in medical devices, optoelectronics devices and consumer products.
His main research interest lies in the fields of advanced electronics packaging, nanofunctional materials and reliability of interconnect materials, including microstructure characterization, elemental diffusion and segregation, efforts are made to understand the reliability of interconnects under thermal, mechanical, and electrical fields. He has received the Gold Medal at the 47th International Exhibition of Inventions of Geneva, the RD100 (Top 100 most significant technologically new product award) in 2019, the CES innovation award in 2019, the best paper award on lead-free solder joint reliability in 2009 at ICEPT international conference. He has been authored over 20 papers in conference and peer reviewed journals and holds over 20 granted and pending US patents.
Dr. Pun holds BE and MSc and received his doctoral degree from City University of Hong Kong. He serves as a technical co-chair of ICEPT international conference. He has also given keynote speeches at numerous conferences and technical symposiums related to electronics IC packaging and materials.