Prof. Paul Kim Ho CHU (朱劍豪)

MSc PhD Cornell University, USA
BSc The Ohio State University, USA
Fellow of APS, AVS, IEEE, MRS, HKAES, and HKIE

Visiting address
YEUNG-G6714
Phone: +852 34427724

Author IDs

Willing to take PhD students: yes

Qualifications/Experiences

  • Chair Professor of Materials Engineering, Department of Physics and Department of Materials Science and Engineering, City University of Hong Kong (CityU), Hong Kong (2017 - present)
  • Co-Founder and Board Member, China Morefound Technology Ltd., Shenzhen, China (2017 - present)
  • Co-Founder and Board Member, Chengdu PulseTech Electrical Company Limited, Chengdu, China (2001 - present)
  • Founder and Board Member, Plasma Technology Limited, Hong Kong (1998 - present)
  • Chair Professor of Materials Engineering, Department of Physics and Materials Science, City University of Hong Kong (CityU), Hong Kong (2001 – 2017)
  • Professor, Department of Physics & Materials Science, City University of Hong Kong (CityU), Hong Kong (1996 – 2001)
  • Visiting Professor, Department of Physics & Materials Science, City University of Hong Kong, Hong Kong (1994 –1996)
  • Visiting Fellow, Department of Applied Science, City Polytechnic of Hong Kong, Hong Kong (1990 –1994) – voted “Best Lecturer” and “Best Speaker” by students in 1993
  • President, Evans Asia Limited, Asia and USA (1990-2001)
  • Assistant to the Director, Charles Evans & Associates, Redwood City, California, USA (1990)
  • Manager, SIMS Services, Charles Evans & Associates, Redwood City, California, USA (1986 –1989)
  • Senior Analyst / Associate Manager, Charles Evans & Associates, San Mateo, California, USA (1985 – 1986)
  • Staff Analyst, Charles Evans & Associates, San Mateo, California, USA (1982 –1984)
  • Research Assistant, Cornell University, Ithaca, New York, USA (1979 –1982)
  • Teaching Assistant, Cornell University, Ithaca, New York, USA (1977 –1979) – won DuPont Teaching Award in 1978
  • Research Assistant, The Ohio State University, Columbus, Ohio, USA (1977)
  • Research Chemist, New England Aquarium, Boston, Massachusetts, USA (1976) – won American Chemical Society Summer Fellowship
  • Laboratory Assistant, Wingate University, Wingate, North Carolina, USA (1975)

Biography

 

Paul K Chu was born in Hong Kong and attended both primary and secondary school at St. Joseph's Anglo-Chinese School.  He enrolled in the honors program at The Ohio State University in Columbus, Ohio and won the Summa AwardThe Arts and Sciences Award, as well as the prestigious American Chemical Society (ACS) Student Fellowship to work at New England Aquarium in Boston, Massachusetts on trace metal analysis of sea water during the summer of 1976.  He received his BS in mathematics (Cum Laude and Phi Kappa Phi) from Ohio State in 1977 and attended graduate school at Cornell University in Ithaca, New York.  He won the DuPont teaching award as a teaching assistant at Cornell in 1978 and joined the research group of Prof. George H Morrison of the Department of Chemistry.  Prof. Morrison was one of the prominent figures in analytical chemistry having been involved with the Apollo moon expedition program.  Prof. Morrison was a winner of the ACS Analytical Chemistry Award and Editor-in-Chief of Analytical Chemistry, the premier journal in analytical chemistry published by the American Chemical Society.  Under the supervision of Prof. Morrison and Prof. James W Mayer of the Department of Materials Science & Engineering, Paul conducted research on ion beam processing and characterization of semiconductors and received his MS and PhD in chemistry in 1979 and 1982, respectively.

After graduation, he joined Charles Evans & Associates in California and during the eight year span from 1982 to 1990, Paul was promoted 4 times and became one of the most recognized international figures in the area of secondary ion mass spectrometry (SIMS).  He was one of the organizers of the SIMS-VII conference in Monterey, California in 1989 and wrote the chapter on SIMS in “Encyclopedia of Materials Characterization”.  In 1990, Paul founded his first company, Evans Asia Ltd., in Hong Kong / Taiwan / Singapore / China specializing in materials characterization and analytical equipment.

 

In 1996, he joined City University of Hong Kong as a faculty member and ventured into the new area of plasma immersion ion implantation (PIII).  He obtained financial support from City University of Hong Kong, The University of Hong Kong, Hong Kong University of Science & Technology, as well as Hong Kong Research Grants Council (RGC) to establish the Plasma Laboratory in City University of Hong Kong which has emerged to be one of the most well known and versatile PIII facilities in the world.  He is one of the leading international figures in plasma-based materials engineering being the Chairman of the International Plasma-Based Ion Implantation Executive Committee which organizes the biennial International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D) as well as a member of the Ion Implantation Technology (IIT) International Committee that organizes the biennial International Conference on Ion Implantation Technology.

He joined IEEE in 1997, became a senior member in 1999, and was elected Fellow of the Institute of Electrical and Electronics Engineers in 2003 for contributions to the understanding of plasma immersion ion implantation and deposition.  He was the recipient of the 2007 IEEE / NPSS (Nuclear and Plasma Sciences Society) Merit Award for his contributions to the understanding, development, and applications of plasma-based surface modification and thin film deposition technologies.  The IEEE / NPSS Merit Award is the most prestigious award given by the IEEE NPSS to recognize outstanding technical contributions to the fields of nuclear and plasma sciencesand he is the first winner from an Asian institution since the award was first given in 1972.  He is a member of the IEEE Nuclear and Plasma Sciences Society Fellow Evaluation Committee which reviews and makes recommendation on IEEE fellow nominations (since 2009).  After serving asSenior Editor of IEEE Transactions on Plasma Science from 2006 to 2013, he continues to be Supervising Senior Editor of the journal overseeing selected special issues.  He was a member of the international advisory board of the IEEE International Conference on Plasma Science (ICOPS) from 1996 to 1998 and 2014, guest editor of 5 special issues of IEEE Transactions on Plasma Science [vol. 39, no. 11 (2011)vol. 37, no. 7 (2009)vol. 34, no. 4 (2006);  vol. 33, no. 2 (2005);vol. 32, no. 2 (2004)], and executive committee (ExCom) member of the IEEE Plasma Science and Application Committee (PSAC) from 2007 to 2009.  He was the general chair of the 3rd IEEE International NanoElectronics Conference in Hong Kong in 2010, editor of the IEEE INEC 2010 special issue published in Materials Science and Engineering Reports [vol. 70, no. 3-6 (2010)], and co-guest editor of the IEEE INEC 2010 special issue published in Journal of Nanoscience and Nanotechnology [vol. 11, no. 12 (2011)].

He joined AVS (American Vacuum Society) in 2002 and was elected Fellow of AVS in 2006 for contributions to plasma science and surface engineering of materials and industrial components. 

He joined APS (American Physical Society) in 2007 and was elected Fellow of APS in 2008 forseminal contributions to the understanding of plasma - materials interactions as well as development and applications of innovative plasma-based surface modification and materials synthesis technologies and instrumentation.  He served on the American Physical Society (APS) Division of Materials Physics (DMP) Nominating Committee from 2008 to 2009.

He was elected Fellow of the Materials Research Society (MRS) in 2013 for outstanding contributions to the development of plasma immersion ion implantation for modifying materials surfaces to improve functional properties and obtain novel structures for industrial and biomedical applications.  He was a co-chair / organizer of Symposium GG: Ion-Beam-Based Nanofabricationin the MRS Spring Meeting in San Francisco in 2007, co-editor of MRS Symposium Proceedings volume 1020, co-chair / organizer of Symposium DD: Ion Beams and Nano-Engineering in the MRS Spring Meeting in San Francisco in 2009, and co-editor of MRS Symposium Proceedings volume 1181.

He was elected a scientific member of the Böhmishe Physical Society for contributions to ion beam analysis and plasma source ion implantation in 1997.  He is also a member of the American Chemical Society (ACS).

He is associate editor of Materials Science and Engineering: Reports (since 2005) and a member of the editorial board of International Journal of Molecular Engineering (since 2006), Surface and Interface Analysis (since 2006), Recent Patents on Materials Science (since 2008), Biomaterials(since 2010), Surface and Coatings Technology (since 2011), Versita [Physics] (since 2012),Advanced Materials Interfaces (since 2013), and Materials and Surfaces for Biocompatible Systems (since 2015).  He was associate editor of International Journal of Plasma Science and Engineering from 2007 to 2010 and a member of the editorial board of Nuclear Instruments and Methods in Physics Research B: Beam Interactions with Materials and Atoms from 2000 to 2006, Plasma Sources Science and Technology from 2008 to 2012, and Cancer Nanotechnology: Basic, Translational and Clinical Research from 2009 to 2015.  He was chief guest editor of the SMMIB2011 special issue published in Vacuum [vol. 89 (2013)], SMMIB2015 special issue published in Surface and Coatings Technology [vol. 306, part A (2016)], PBII&D2015 special issue published in Surface Coatings Technology [vol. 312 (2017)], as well as guest editor of the PBII&D2005 special issue published in Surface and Coatings Technology [vol. 201, no. 15 (2007)].  He was guest editor of the special issue on "Mechanical and Tribological Properties of Biomedical Coatings and Surface-Modified Biomaterials" published in Surface and Coatings Technology [vol. 233 (2013)].

Locally, he was elected Fellow of the Hong Kong Institute of Engineers (FHKIE) in 1999 and Fellow of the Hong Kong Academy of Engineering Sciences (FHKAES 香港工程科學院院士) for seminal contributions to surface functionalization and engineering of functional materials and industrial components by plasma-based and related technology in 2014.  He served on the Membership Committee (Process Engineering) of the Hong Kong Academy of Engineering Sciences in 2017 and 2018.  He was awarded The President's Award by City University of Hong Kong in 2015 and 2016 for his exemplary contributions to research and professional education.  He was a member of the Hong Kong Research Grants Council (RGC) Hong Kong PhD Fellowship Scheme Selection Committee from 2011 to 2014 and served on the Hong Kong Research Grants Council (RGC) Engineering Panel from 2000 to 2006.

He was awarded Thousand Talents of China (中國國家千人), Leading Talents of Guangdong Province of China (中國廣東省領軍人才), and Leader of Shenzhen Peacock Team (中國深圳孔雀團隊帶頭人) in 2016.  The research team comprising Profs. Xuanyong Liu, Paul Chu, and Chuanxian Ding won the 2011 Shanghai Natural Science Award (First Class) 上海自然科學一等獎.  The research team of Profs. Xinglong Wu, Paul K. Chu, Shijie Xiong, Jiancang Shen, Peiheng Wu, Jian Chen, Jiyang Fan, Zhao Liu, Liwen Yang, and Gaoshan Huang won the 2017 Chinese Ministry of Education Natural Science Award (First Class) 中國教育部自然科學一等獎.  The research team of Profs. Kaifu Huo, Paul K. Chu, Xuming Zhang, Wei Xiong, and Biao Gao won the 2018 Hubei Province (China) Natural Science Award (Second Class) 湖北省自然科學二等獎 He is Honorary Director of the International Research and Development Center for Surface Engineering of Materials at Xian Jiaotong University, China (since 2009) and a member of the standing committee of the Chinese Mechanical Engineering Society.  He was technical advisor to the National 863 Materials & Surface Engineering R&D Center in Shenzhen in China.

In addition to being Chair Professor of Materials Engineering in the Department of Physics and Department of Materials Science and Engineering in City University of Hong Kong, he holds or has held advisory / consulting / visiting professorship in 15 universities and research institutes in China: Peking University (Beijing), Fudan University (Shanghai), Shanghai Jiaotong University (Shanghai), Southwest Jiaotong University (Chengdu), Harbin Institute of Technology (Harbin), Nanjing University (Nanjing), Jiamusi University (Jiamusi), Southwestern Institute of Physics (Chengdu), Shanghai Institute of Ceramics, Chinese Academy of Sciences (Shanghai), Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (Shanghai), Xi'an Jiaotong University (Xi'an), Sichuan University (Chengdu), Wuhan University of Science and Technology (Wuhan), Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (Shenzhen), and Hohai University (Nanjing).

He established a joint PhD program with the University of Sydney in Australia in which students in his research group in City University of Hong Kong or School of Physics in the University of Sydney received PhD degrees from both universities upon graduation.  He won the DuPont Teaching Award at Cornell University and at City University of Hong Kong, he was voted “best lecturer” and “best presenter” by students in his department.  He has also taught many short courses and professional seminars on materials characterization and processing in universities and companies in the US, Canada, China, Japan, Korea, Taiwan, and Singapore.

His research activities are quite diverse, spanning plasma science & engineering, surface modification & functional thin films, biomaterials, energy materials, as well as nanostructured materials.  He is the co-author of 1 book and co-editor of eight books on ion beam nanofabrication, biomaterials, nanotechnology, plasma science and engineering, and surface modification.  He has authored / co-authored more than 35 book chapters, 1,600 papers in international refereed journals, and 1,000 international conference papers including over 150 plenary, keynote, and invited talks.  For updated citation information, please browse his pages on Google Scholars,Thomson Reuters ResearcherID, and Scopus.  His research on plasma-modified materials, microelectronic/optoelectronic materials, biomaterials & medical implants, energy materials, as well as nanostructured materials has been featured many times in magazines and journals such as Science, Nature Photonics, and Nature Nanotechnology.  He has obtained over US$20 million in research funding from agencies and companies in Hong Kong, Australia, China, Germany, Switzerland, and the US.  Two of his research projects were awarded the "Excellent" rating by City University of Hong Kong and Hong Kong Research Grants Council and many of his conference papers have received best paper awards.  He was presented the Award of Excellence under the Research Excellence Awards Scheme by City University of Hong Kong in 2007 and is a highly cited researcher in materials science according to Thomson Reuters.

In addition to fundamental research, he is extensively engaged in applied research and industrial applications.  His innovations on plasma processing and instrumentation have led to 14 United States patents, 11 Chinese patents, and 1 European patent.   He founded his second company,Plasma Technology Ltd., in 1998 and co-founded his third company, Chengdu Pulsetech Electrical Co. Ltd., in 2001 to address the Chinese and international markets.  The companies specialize in the development of commercial plasma-based technologies as well as hardware including ion sources, plasma ion implanters, and power supplies while also providing consultation to the industry.  He co-founded China Morefound Technology Ltd. in 2016.  He was awarded the Applied Research Certificate of Merits for innovations in plasma instrumentation and power supplies by City University of Hong Kong in 2004.  Plasma Technology Ltd. received the Hong Kong Awards for Industry: Technological Achievement Certificate of Meritfor the development of plasma implantation and deposition technologies in 2004 and again in 2011.  Paul's research group produced the world’s first 100mm and 150mm silicon-on-insulator (SOI) wafers by plasma immersion ion implantation and ion-cutting and the invention that was featured on the cover of the 40th anniversary issue of Solid State Technology as the representative technology from Hong Kong was instrumental to the establishment of Silicon Genesis Corporation in the Silicon Valley in California.

He participates actively in amateur sports and is Honorary Manager of the City University of Hong Kong varsity badminton and swimming teams.  He has won men's singles, men's doubles, mixed doubles, and teams' events several times in CityU Student/Staff badminton tournaments.  In swimming, he holds three current City University of Hong Kong staff records, held one CityU staff swimming record from 2001 to 2012, co-held two Hong Kong masters swimming records from 1998/1999 to 2006, and won more than 100 medals in Hong Kong masters swimming competitions.

Research Interests/Areas

  • Plasma science and engineering
  • Surface engineering of functional materials
  • Biomaterials and nanobiology
  • Energy and sensor materials
  • Nanostructured thin films and interfaces 

Prizes/Honours

Services in CityU

  • Member, Student Discipline Committee (2011 – present)
  • Member, Culture and Sports Committee (2005 – present)
  • Honorary Manager, CityU Varsity Badminton Team (1999 - present)
  • Honorary Manager, CityU Varsity Swimming Team (1999 - present)
  • Member, CSE College Board (current)
  • Member, Research Center Committee (current)
  • Member, University Senate (current)
  • Member, University Court (current)

Services outside CityU

Chairman

  • Chairman, International Plasma-Based Ion Implantation and Deposition Committee (2005 - present)

Director/Board Member/Advisor

  • Board Member and Co-Founder, China Morefound Technology Ltd., Shenzhen, China (2017 - present)
  • Board Member and Co-Founder, Chengdu PulseTech Electrical Co. Ltd., Chengdu, China (2001 - present)
  • Board Member and Founder, Plasma Technology Ltd., Hong Kong (1998 - present)
  • Honorary Director, International Research and Development Center for Surface Engineering of Materials, Xian Jiaotong University, China (2009 - present)
  • Technical Advisor, National Materials & Surface Engineering Research and Development Center (Project 863), Shenzhen, China (2001 – 2010)
  • Advisor, Shenzhen Polytechnic, Shenzhen, China (2007 – 2009)
  • Advisor, National Microanalysis Center for Microelectronic Materials & Devices, Shanghai, China (1991 - 2000)

Committee Member

  • Member, IEEE Nuclear and Plasma Sciences Society Fellow Evaluation Committee, USA (2009 – present)
  • Member, Ion Implantation Technology International Committee (2004 - present)
  • Member (Process Engineering), Membership Committee, Hong Kong Academy of Engineering Sciences (2016 - 2018)
  • Member, Hong Kong Research Grants Council (RGC) Hong Kong PhD Fellowship Scheme Selection Committee (2011 – 2014)
  • Member, American Physical Society (APS) Division of Materials Physics Nominating Committee (2008 – 2009)
  • Member, IEEE Plasma Science and Application Executive Committee (PSAC) (2007 – 2009)
  • Member, Hong Kong Institution of Engineers (HKIE) Materials Division Committee (2004 – 2005)
  • Member, Hong Kong Research Grants Committee (RGC) Engineering Panel (2000 – 2006)
  • Coordinator, International Plasma Doping Users Group (1998 – 2005)
  • Member, Technical Advisory Board, Silicon Genesis Corporation, Campbell, California, USA (1997 –1998)
  • Member, International Plasma-Based Ion Implantation and Deposition Committee (1996 – 2004)

 Advisory/Consulting/Visiting Professor

Consultant

  • Technical / Business Consultant, Physical Electronics Corporation, Minnesota, USA (1996 –1998)
  • Specialist, ISO 9000/2 Certification and Audit, Det Norske Veritas, Hong Kong (1995 –1999)
  • Business Consultant, Balazs Analytical Laboratories, Sunnyvale, California, USA (1990 – 1996)
  • Technical / Business Consultant, Cameca Instruments, Paris, France (1990 – 1993)
  • Business Consultant, AMER-TEM, Sunnyvale, California, USA (1990 – 1991)
  • Business Consultant, Solecon Laboratory, San Jose, California, USA (1990 – 1991)

 

Activities

Conference Organization

Prof. Paul Chu has served as general chair, co-chairman, co-organizer, member of advisory / international / organizing / program committee, or session chair of many international conferences on plasma science, microelectronics processing, and materials science and engineering, including:

  • Plasma-Based Ion Implantation and Deposition (PBII&D) Workshop - Dresden, Germany 1996; Detroit, USA 1998; Kyoto, Japan 1999; Grenoble, France 2001; San Antonio, USA 2003; Chengdu, China 2005; Leipzig, Germany 2007; Sao Paulo, Brazil 2009; Harbin, China 2011; Poitiers, France 2013; Buenos Aires, Argentina 2015; Shanghai, China 2017
  • International Ion Implantation Technology Conference (IIT) - Taipei, Taiwan 2004; Marseille, France 2006; Monterey, USA 2008; Kyoto, Japan 2010; Valladolid, Spain 2012; Tainan, Taiwan 2016; Würzburg, Germany 2018
  • IEEE International Conference on Plasma Science (ICOPS) - Boston, USA 1996; San Diego, USA 1997; Raleigh, USA 1998; Monterey, USA 1999; Jeju, Korea 2003; Washington DC, USA 2014
  • Materials Research Society (MRS) - Spring Meeting, San Francisco, USA 2007; Spring Meeting, San Francisco, USA 2009
  • Materials Research Society Japan (MRS-J) Annual Meeting – Yokohama, Japan 2010; Yokohama, Japan 2011, Yokohama, Japan 2012, Yokohama, Japan 2013, Yokohama, Japan 2015; Yokohama, Japan 2016; Kokura, Japan 2018
  • IUMRS (International Union of Materials Research Societies) International Conference in Asia (ICA) - Nagoya, Japan 2008; Fukuoka, Japan 2014
  • IUMRS (International Union of Materials Research Societies) International Conference on Advanced Materials (15th IUMRS-ICAM) - Kyoto, Japan 2017
  • IUMRS (International Union of Materials Research Societies) International Conference on Electronic Materials (IUMRS-ICEM 2012) - Yokohama, Japan 2012
  • International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Beijing, China 1986, 1992, 1995, 1998; Shanghai, China 2001; Beijing, China 2004; Shanghai, China 2006; Beijing, China 2008; Shanghai, China 2010; Guilin, China 2014
  • International Conference on Materials and Process Characterization (ICMPC) - Shanghai, China 1988, 1991; Kunming, China 1994; Shanghai, China 1997
  • 7th Secondary Ion Mass Spectrometry Conference (SIMS-VII) - Monterey, USA 1989
  • International Conference on Plasma Science & Technology (ICPST) - Chengdu, China 1994
  • International Conference on Surface Engineering (ICSE) - Shanghai, China 1997; Shenzhen, China 2004
  • International Conference on Physical and Numerical Simulation of Materials and Hot Working  (ICPNS) - Beijing, China 1999
  • International Workshop on Junction Technology (IWJT) - Tokyo, Japan 2001; Shanghai, China 2004; Tokyo, Japan 2005; Shanghai, China 2006; Kyoto, Japan 2007; Shanghai, China 2008; Tokyo, Japan 2009; Shanghai, China 2010; Kyoto, Japan 2013; Kyoto, Japan 2015; Kyoto, Japan 2017
  • 14th Chinese National and Taiwan/ Hong Kong Semiconductor Physics Conference - Hong Kong 2003
  • WINP  - Hong Kong 2003
  • 2nd International Workshop on Particle Beams & Plasma Interaction on Materials and 2nd Asia Symposium on Ion & Plasma Surface Finishing (PIM & ASIP) - Thailand 2004
  • Asian-European International Conference on Plasma Surface Engineering (AEPSE) - Qingdao, China 2005; Nagasaki, Japan 2007; Dalian, China 2011
  • International Conference on Surfaces, Coatings and Nanostructured Materials  (ICSCnanoSMat) - Aveiro, Portugal 2005; Algarve, Portugal 2007
  • International Conference on Ion Beam Modification of Materials (IBMM) - Taormina, Italy 2006; Dresden, Germany 2008
  • Siam Physics Congress (SPC) - Nakorn Pathom, Thailand 2007
  • International Symposium on Surface and Interface of Biomaterials (SIB) - Chengdu, China 2007
  • International Conference on Surface Modification of Materials by Ion Beams (SMMIB) - Mumbai, India 2007; Harbin, China 2011; Kusadasi, Turkey 2013; Chiang Mai, Thailand 2015; Lisbon, Portugal 2017; Tomsk, Russia 2019
  • Joint International Conference of 3rd International Conference on Surface and Interface Science and Engineering (SISE 2007) and Symposium on Surface Engineering for Industrial Applications (SEIA 2007) - Singapore 2007
  • IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC 2007) - Tainan, Taiwan 2007
  • IEEE International Nanoelectronics Conference (INEC) - Shanghai, China 2008; Hong Kong 2010; Singapore 2013
  • Biomedical Engineering International Conference (BME) - Hong Kong 2008; Hong Kong 2010
  • Biomaterials Asia - Hong Kong 2009
  • 51st APS Annual Meeting of the Division of Plasma Physics - Atlanta, USA 2009
  • 11th Asia Pacific Physics Conference - Shanghai, China 2010
  • 3rd International Conference on Microelectronics and Plasma Technology (ICMAP) - Dalian, China 2011
  • International Conference on Shape Memory and Superelastic Technologies (SMST) 2011 SMA Workshop - Hong Kong 2011
  • International Conference on Technological Advances of Thin Films and Surface Coatings (ThinFilms2012) - Singapore 2012
  • 4th Asian Biomaterials Congress (ABCM4) - Hong Kong 2012
  • International Conference on Bioinspired and Biobased Chemistry & Materials - Nice, France 2012
  • International Conference on Nanotechnology: Fundamentals and Applications (ICNFA) - Montreal, Canada 2012; Toronto, Canada 2013; Prague, Czech Republic 2014; Barcelona, Spain 2015
  • 8th Cross-Strait Film Science and Technology Seminar - Ningbo, China 2012
  • Materials Science & Technology Conference & Exhibition (MS&T) - Pittsburgh, USA 2012
  • 4th Asian Biomaterials Congress - Hong Kong 2013
  • International Conference on Design, Analysis, Manufacturing, and Simulation (ICDAMS 2013) - Chennai, India 2013
  • International Conference on Advances in Manufacturing and Materials Engineering (AMME-2014) - Karnataka, India 2014
  • International Conference on Engineering Applications of Nanotechnology (ICEA) - Visakhapatnam, India 2014
  • International Congress on Materials and Metallurgy (CMAM) - Hong Kong 2015
  • AVS Shanghai Thin Film (TF) Conference - Shanghai 2015
  • European congress on Corrosion and Surface Treatment in Industry - Tatra, Slovakia 2015
  • Asia-Pacific Conference on Plasma Physics (AAPPS-DPP) - Chengdu, China 2017; Kanazawa, Japan 2018
  • International Conference on Applied Surface Science (ICASS) - Dalian, China 2017
  • 2018 Asia-Pacific Conference on Plasma and Terahertz Science (APCOPTS) - Xi’an, China 2018
  • 2nd International Conference on Advanced Functional Materials & Interfaces (AFMI) – Wuhan, China 2018

Editor or Editorial Membership

  • Supervising Senior Editor, IEEE Transactions on Plasma Science (2013 - present)
  • Associate Editor, Materials Science and Engineering: Reports (2005 - present)
  • Associate Editor, International Journal of Plasma Science and Engineering (2007– 2010)
  • Senior Editor, IEEE Transactions on Plasma Science (2006 – 2013) 
  • Chief Guest Editor, Surface and Coatings Technology, vol. 312 (2017)
  • Chief Guest Editor, Surface and Coatings Technology, vol. 306, part A (2016)
  • Chief Guest Editor, Vacuum, vol. 89 (2013)
  • Special Issue Editor, Materials Science and Engineering Reports, vol. 70, no. 3 – 6 (2010)
  • Co-Guest Editor, Surface and Coatings Technology, vol. 233 (2013)
  • Co-Guest Editor, Surface and Coatings Technology, vol. 229 (2013)
  • Co-Guest Editor, Journal of Nanoscience and Nanotechnology, vol. 11, no. 12 (2011)
  • Co-Guest Editor, IEEE Transactions on Plasma Science, vol. 39, no. 11 (2011)
  • Co-Guest Editor, IEEE Transactions on Plasma Science, vol. 37, no. 7 (2009)
  • Co-Guest Editor, Surface and Coatings Technology, vol. 201, no. 15 (2007)
  • Co-Guest Editor, IEEE Transactions on Plasma Science, vol. 34, no. 4 (2006)
  • Co-Guest Editor, IEEE Transactions on Plasma Science, vol. 33, no. 2 (2005)
  • Co-Guest Editor, IEEE Transactions on Plasma Science, vol. 32, no. 2 (2004)
  • Editorial Board Member, Materials and Surfaces for Biocompatible Systems (2015 - present)
  • Editorial Board Member, Advanced Materials Interfaces (2013 - present) 
  • Editorial Board Member, Versita (Physics) (2012 - present)
  • Editorial Board Member, Surface and Coatings Technology (2011 - present)
  • Editorial Board Member, Biomaterials (2010 - present)
  • Editorial Board Member, Recent Patents on Materials Science (2008 - present)
  • Editorial Board Member, International Journal of Molecular Engineering (2006 - present)
  • Editorial Board Member, Surface and Interface Analysis (2006 - present)
  • Editorial Board Member, Cancer Nanotechnology: Basic, Translational and Clinical Research (2009 – 2015)
  • Editorial Board Member, Plasma Sources Science and Technology (2008 – 2012)
  • Editorial Board Member, Nuclear Instruments & Methods in Physics Research B: Beam Interactions with Materials and Atoms (NIM-B) published by Elsevier Science (2001 – 2006)
  • Newsletter Editor, Asia-Pacific Microanalysis Association (1993 –2000)

Patents

United States Patents     

  1. Paul K. Chu and Chung Chan, "Perforated Shields for Plasma Immersion Ion Implantation”US 6,051,073 (Application # 018419-002410US; Issued on April 18, 2000).
  2. Paul K. Chu and Aiguo Liu, “Distributed System and Code for Control and Automation of Plasma Immersion Ion Implanter”US 6,113,735(Application #018419-005210US; Issued on September 5, 2000).
  3. Paul K. Chu and Chung Chan, “Removable Liner Design for Plasma Immersion Ion Implantation”US 6,120,660 (Application #018419-002520US; Issued on September 19, 2000).
  4. Paul K. Chu and Chung Chan, "Shielded Platen Assembly for Plasma Immersion Ion Implantation”US 6,186,091 (Application #018419-002610US; Issued on Feb 13, 2001).
  5. Paul K. Chu and Chung Chan, "Coated Platen Design for Plasma Immersion Ion Implantation”US 6,217,724 (Application #018419-002510US; Issued on April 17, 2001).
  6. Paul K. Chu and Chung Chan, "Contoured Platen Design for Plasma Immersion Ion Implantation”, US 6,228,176 (Application #018419-002710US; Issued on May 8, 2001).
  7. Paul K. Chu and Chung Chan, “Collection Devices for Plasma Immersion Ion Implantation”US 6,269,765 (Application #018419-002310US; Issued on August 7, 2001).
  8. Paul K. Chu and Liuhe Li, “Method and Apparatus for Automatically Re-Igniting Vacuum Arc Plasma Source”US 6,740,843 (Application #10/243,084; Issued on May 25, 2004).
  9. Paul K. Chu, Deli Tang, Shihao Pu, Honghui Tong, and Qingchuan Chen, “Ion Source with Upstream Inner Magnetic Pole Piece”, US 7,589,474 B2(Application #11/567,333; Issued on September 15, 2009).
  10. Paul K. Chu and Liuhe Li, “Apparatus and Method for Focused Electric Field Enhanced Plasma-Based Ion Implantation”, US 7,741,621 B2 (Application #10/891,309; Issued on June 22, 2010
  11. Kelvin W. K. Yeung, Ray W. Y. Poon, Paul K. Chu, Kenneth M. C. Cheung, and William W. Lu, "Surface Treated Shape Memory Materials and Methods for Making Same", US 7,803,234 B2 (Application #11/331.264; Issued on September 28, 2010).
  12. Paul K. Chu and Liuhe Li, “Apparatus and Method for Focused Electric Field Enhanced Plasma-Based Ion Implantation”, US 8,119,208 B2 (Application #12/106,009; Issued on February 21, 2012).
  13. Roy A. L. Vellaismy, Zong-Xiang Xu, Paul K. Chu, and Tat Kun Kwok, “Nickel Complexes for Flexible Transistors and Inverters”, US 8,981,096 B2 (Application  #13/097,656; Issued on March 17, 2015).
  14. Roy A. L. Vellaismy, Zong-Xiang Xu, Paul K. Chu, and Tat Kun Kwok, “Nickel Complexes for Flexible Transistors and Inverters”, US 9,711,738 B2 (Application  #14/636,921; Issued on July 18, 2017).

中國專利 Chinese Patents

  1. * 朱劍豪, 李劉合, “真空電弧自動引弧裝置”, 專利號: ZL-02240946.7, 國際分類號: C23C14/00 (申請日: 2002年7月2日; 授權日: 2003年5月7日). Paul K. Chu and Liuhe Li, “Automatically Re-Igniting Direct Current (DC) Vacuum Arc Plasma Source”, Chinese patent # ZL 02240946.7 (issued on May 7, 2003).
  2. 田修波, 朱劍豪 ,楊士勤, “利用高壓輝光放電對管筒狀工件内表面離子注入的裝置”, 專利號: ZL 02275571.4 (申請日: 2002年9月30日; 授權日: 2003年10月1日). Xiubo Tian, Paul K. Chu, and Shiqin Yang, “Apparatus for Plasma Ion Implantation into Inner Surface of Tube-Shaped Samples Using High Voltage Glow Discharge”, Chinese patent # ZL 02275571.4 (issued on October 1, 2003).
  3. 朱劍豪, 郭達勤, 曾旭初, 陳聰, “采用接地導電栅網的直流等離子注入裝置”, 專利號: ZL-00-1-06152.6, 國際分類號: H01J37/317 (申請日: 2000年4月27日; 授權日: 2004年9月22日). Paul K. Chu, Dixon T. K. Kwok, Xuchu Zeng, and Chung Chan, “Apparatus for Direct Current Plasma Immersion Ion Implantation Using a Grounded Grid”, Chinese patent # ZL 00106152.6 (issued on September 22, 2004).
  4. 朱劍豪, 李劉合, “真空電弧自動引弧方法與裝置”, 專利號: ZL-02141205.7, 國際分類號: C23C14/22 (申請日: 2002年7月2日; 授權日: 2005年6月22日). Paul K. Chu and Liuhe Li, “Automatically Re-Igniting Vacuum Arc Method and Equipment”, Chinese patent # ZL 02141205.7 (issued on June 22, 2005).
  5. 李劉合, 蔡珣, 朱劍豪, “離子注入或者注入且沉積的材料表面改性方法”, 專利號: ZL 200410108295.1, 國際分類號: C23C14/48, C23C8/36 (申請日: 2004年5月13日; 授權日: 2006年8月9日). Liuhe Li, Xun Cai, and Paul K. Chu, “Method for Surface Modification of Materials Using Plasma Immersion Ion Implantation and Deposition”, Chinese patent # ZL 200410108295.1 (issued on August 9, 2006).
  6. 李劉合, 蔡珣, 陳秋龍, 朱劍豪, “自輝光等離子注入基離子注入或者注入且沉積裝置”, 專利號: ZL 200410018294.7, 國際分類號: C23C14/48 (申請日: 2004年5月13日; 授權日: 2007年1月24日). Liuhe Li, Xun Cai, Qiunong Chen, and Paul K. Chu, “Apparatus for Self-Discharge Plasma Immersion Ion Implantation and Deposition”, Chinese patent # ZL 200410018294.7 (issued on January 24, 2007).
  7. 張新平, 張宇鵬, 鍾志源, 朱劍豪, “一種具有梯度孔隙率鎳鈦型記憶合金的制備方法”, 專利號: CN101003868A (申請日: 2006年12月25日; 授權日: 2007年7月25日). Xinping Zhang, Yupeng Zhang, C. Y. Chung, and Paul K. Chu, “Method for Fabrication of Nickel Titanium Shape Memory Alloy with Controlled Porous Structure”, Chinese patent # CN101003868A (issued on July 25, 2007).
  8. 楊偉國, 張文智, 陸瓞驥, 楊芷茵, 高一村, 朱劍豪, “外科手術植入物和制造方法”, 專利號: ZL 201080008828.1 (申請日: 2010年2月28日; 授權日: 2013年11月23日). Kelvin W. K. Yeung, Kenneth M. C. Cheung, Keith D. K. Luk, C. Y. Yeung, Richard Y. T. Kao, and Paul K. Chu, “Surgical Implant Materials and Fabrication Method”, Chinese patent # ZL 201080008828.1 (issued on November 13, 2013).
  9. 郭達勤, 王國華, 吳征威, 熊濤, 朱劍豪, “使用等離子體浸没離子注入(PIII)對活塞環進行渗氮的裝置,專利號: CN103361595B (申請日: 2012年3月27日; 授權日: 2015年12月16日). Tat Kun Kwok, Guohua Wang, Zhengwei Wu, Tao Xiong, and Paul K. Chu, “Plasma Immersion Ion Implantation Apparatus for Nitriding of Piston Rings”, Chinese patent # CN103361595B (#201210083684.7) (issued on December 16, 2015).
  10. 吳水林, 劉想梅, 翁正陽,李霞, 周田, 李滿, 楊偉國, 朱劍豪, “一種具有分級納米結構型狀記憶合金的制備方法”, 專利號: CN103834984A (申請日: 2014年3月5日; 授權日: 2016年4月7日). Shuilin Wu, Xiangmei Liu, Zhengyang Weng, Xia Li, Tian Zhou, Man Li, Kelvin W. K. Yeung, and Paul K. Chu, “Method for Preparation of Hierarchical  Nanostructured Shape Memory Alloy”, Chinese patent # CN103834984A (issued on April 7, 2016).
  11. 吳水林, 劉想梅, 翁正陽,李霞, 周田, 李滿, 楊偉國, 朱劍豪, “一種具有抗菌性納米結構的醫用鈦合金的制備方法”, 專利號: CN1038316574A (申請日: 2014年2月18日; 授權日: 2016年6月1日). Shuilin Wu, Xiangmei Liu, Zhengyang Weng, Xia Li, Tian Zhou, Man Li, Kelvin W. K. Yeung, and Paul K. Chu, “Method for Preparation of Nanostructured Biomedical Titanium Alloy with Anti-Bacterial Surface”, Chinese patent # CN103816574A (issued on June 1, 2016).

Withdrawn in 2011 due to some duplication with Chinese patent # ZL 02141205.7 which is broader and covers a longer period of time

Other Patents     

  1. Kelvin W. K. Yeung, Ray W. Y. Poon, Paul K. Chu, Kenneth M. C. Cheung, and William W. Lu, “Surface Treated Shape Memory Materials and Methods for Making Same”, European Patent # EP 1,835,946 B1 (Application # 06704680.5 [PCT/CN/2006/000038], issued on October 27, 2010).